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Etch-resistant inkjet inks for manufacturing conductive patterns

a technology of etch-resistant inkjet ink and conductive pattern, which is applied in the direction of printing, coating, inks, etc., can solve the problems of high ink viscosity, extra cost and chemical waste, and difficult reliable inkjet printing in an industrial environment process

Inactive Publication Date: 2017-08-03
AGFA GEVAERT AG
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

The patent text describes the creation of a special ink that can be cured quickly and resistant to etching, stripping, and flaking. This ink meets all of the requirements for a high-quality UV curable inkjet ink.

Problems solved by technology

The use of developer to remove the photo resist layer, often 50 μm thick or more, results in extra cost and chemical waste.
These volatile organic solvents lead to latency problems of inkjet print heads making reliable inkjet printing in an industrial environment process problematic.
Reducing the amount of organic solvent leads to a too high ink viscosity, because some aromatic acrylate compounds traditionally used for preparing photo resist coatings have very high viscosity.
Another problem is the flake formation in the alkaline stripping bath.
If the flake size is too large it tends to adhere to stripping equipment disturbing the smooth running of the manufacturing process.
After a while these small flakes accumulate and also start to disturb the smooth running of the manufacturing process.
This multitude of influencing factors makes it very difficult to control the flake size to a desired size.

Method used

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  • Etch-resistant inkjet inks for manufacturing conductive patterns
  • Etch-resistant inkjet inks for manufacturing conductive patterns
  • Etch-resistant inkjet inks for manufacturing conductive patterns

Examples

Experimental program
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Effect test

example 1

[0177]This example illustrates the manufacturing of conductive patterns with UV curable inkjet inks in accordance with the invention.

Preparation of the UV Curable Inkjet Inks

[0178]The comparative UV curable inkjet ink COMP-1 to COMP-11 and the inventive UV curable ink INV-1 to INV-16 were prepared according to a composition of Type A or B in Table 9. The weight percentages (wt %) were all based on the total weight of the UV curable inkjet ink.

TABLE 9wt % in the inkjet inkComponentsType AType BDye-11.001.75Polymerizable composition according86.00 82.25 to Table 4ITX4.005.00EPD4.00—TPO4.002.00BAPO—3.00Irgacure ™ 907—5.00INHIB1.001.00

[0179]The amount and type of monomers used in the polymerizable composition of the inkjet inks are shown in Table 10. The weight percentages (wt %) in Table 4 were all based on the total weight of the polymerizable composition. The viscosity was measured and is shown in Table 11.

TABLE 10Inkjet InkPolymerizable Composition for Table 9SampleTypeAcryl Amidewt...

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Abstract

A UV curable inkjet ink includes a polymerizable composition, wherein at least 80 wt % of the polymerizable composition consists of: a) 15.0 to 70.0 wt % of an acryl amide; b) 20.0 to 75.0 wt % of a polyfunctional acrylate; and c) 1.0 to 15.0 wt % of a monofunctional (meth)acrylate containing a carboxylic acid group, a phosphoric acid group, or a phosphonic acid group; with all weight percentages (wt %) based on the total weight of the polymerizable composition.

Description

CROSS REFERENCE TO RELATED APPLICATIONS[0001]This application is a 371 National Stage Application of PCT / EP2015 / 071147, filed Sep. 16, 2015. This application claims the benefit of European Application No. 14186726.7, filed Sep. 29, 2014, which is incorporated by reference herein in its entirety.BACKGROUND OF THE INVENTION[0002]1. Field of the Invention[0003]The present invention relates to an etch-resistant inkjet ink and a method of manufacturing conductive patterns.[0004]2. Description of the Related Art[0005]Printed circuit boards are usually made by coating a photo resist layer on a copper sheet bonded to a non-conductive substrate, applying a temporary UV mask of a negative image of a desired conductive pattern, UV exposing the photo resist layer, removing the non-exposed photo resist layer by a developer, removing unwanted copper by etching, removing the exposed photo resist layer by an alkaline stripping bath, thereby leaving only the desired conductive copper pattern present...

Claims

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Application Information

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Patent Type & Authority Applications(United States)
IPC IPC(8): C09D11/101C09D11/30
CPCC09D11/30C09D11/101B44B5/0004B44C1/227C23F1/02C23F1/16C23F1/32C09D11/328C23F1/18B44C5/0415C09D11/106B41J2/01B41M5/0023B41M5/0047B41M5/0058B41M7/0009B41M7/0081B41M2205/14B41M2205/18C09D11/107C25D5/022B29C59/022B29L2009/00
Inventor TORFS, RITALOCCUFIER, JOHAN
Owner AGFA GEVAERT AG
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