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Heat dissipation device

a heat dissipation device and heat dissipation chamber technology, which is applied in indirect heat exchangers, lighting and heating apparatus, and semiconductor/solid-state device details. it can solve the problems of unsatisfactory circulating efficacy of working liquid within the thermosyphon heat exchanger, large heat generation, and inability to effectively remove heat from the computer or electronic device. achieve the effect of enhancing the efficiency of vaporizing the working medium, enhancing the efficiency of vapor

Inactive Publication Date: 2019-08-29
AURAS TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

The present invention provides a heat dissipation device with a vaporization-enhancing structure that increases the thermal contact area and enhances the efficiency of vaporizing the working medium. This results in enhanced heat dissipation performance. The vaporization-enhancing structure includes a first storage structure, at least one first pipe, at least one heat sink fin group, and an additional vaporization-enhancing structure. The vaporization-enhancing structure facilitates liquid-gas transformation of the working medium, so that the working medium moves in a direction toward the first end of the first channel. The vaporization-enhancing structure includes plural skived fins that increase the thermal contact area and enhance the vaporizing speed of the working medium. The overall heat dissipation performance of the heat dissipation device is increased.

Problems solved by technology

During operations of the computers and the electronic devices, a great deal of heat is generated.
If the heat cannot be effectively dissipated away, some drawbacks occur.
However, in some usage situations, the thermosyphon heat exchanger is unable to effectively remove the heat from the computer or the electronic device because the circulating efficacy of the working liquid within the thermosyphon heat exchanger is unsatisfied.

Method used

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first embodiment

[0035]Please refer to FIGS. 1, 2 and 3. FIG. 1 is a schematic perspective view illustrating the outer appearance of a heat dissipation device according to the present invention. FIG. 2 is a schematic exploded view illustrating a portion of the heat dissipation device as shown in FIG. 1. FIG. 3 is a schematic cross-sectional view illustrating a portion of the heat dissipation device as shown in FIG. 1. The heat dissipation device 1A comprises a first storage structure 11, a second storage structure 12, plural first pipes 13, plural heat sink fin groups 14 and a vaporization-enhancing structure 15. The second storage structure 12 is located over the first storage structure 11. The first storage structure 11 comprises a first chamber 111. The second storage structure 12 comprises a second chamber 121. An inner portion of each first pipe 13 has a first channel 131. A first end 1311 of the first channel 131 is in fluid communication with the first chamber 111. A second end 1312 of the fi...

seventh embodiment

[0047]FIG. 9 is a schematic cross-sectional view illustrating a portion of a heat dissipation device according to the present invention. For succinctness, only some components are shown in FIG. 9. That is, the first storage structure 11, the second storage structure 12, the first pipes 13 and the heat sink fin groups 14 are not shown. The structures of the components of the heat dissipation device 1G which are similar to those of the heat dissipation device of the above embodiments are not redundantly described herein. In comparison with the above embodiments, the heat dissipation device 1G further comprises a third storage structure 191, plural second pipes 192, plural heat sink fin groups 193 and an additional vaporization-enhancing structure 194. The third storage structure 191 is located beside a lateral side (e.g., a left side) of the second storage structure 12. Alternatively, the third storage structure 191 is arranged between the first storage structure 11 and the second sto...

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Abstract

A heat dissipation device includes a storage structure, plural pipes, plural heat sink fin groups and a vaporization-enhancing structure. The heat sink fin groups are disposed on outer surfaces of the pipes. The storage structure includes a chamber. The storage structure is in thermal contact with a heat source. Each pipe has a channel. A first end of the channel is in fluid communication with the chamber. A working medium is filled in the chamber and the channels of the pipes. The vaporization-enhancing structure is disposed within the chamber and in thermal contact with at least a portion of the working medium. After the vaporization-enhancing structure receives heat energy from the heat source, the heat energy is transferred to the working medium. The vaporization-enhancing structure facilitates liquid-gas transformation of the working medium. Consequently, the working medium moves toward a second end of the first channel.

Description

FIELD OF THE INVENTION[0001]The present invention relates to a heat dissipation device, and more particularly to a heat dissipation device for dissipating heat through two phase changes.BACKGROUND OF THE INVENTION[0002]With increasing development of computers and various electronic devices, people in the modern societies are used to using the computers and the electronic devices for a long time. During operations of the computers and the electronic devices, a great deal of heat is generated. If the heat cannot be effectively dissipated away, some drawbacks occur.[0003]For solving the above drawbacks, various heat dissipation mechanisms such as airflow convection mechanisms (e.g., through fans), water cooling mechanisms or thermosyphon mechanisms are widely used. For example, thermosiphon is heat dissipation method for allowing a working medium (e.g., water) to flow along a circular loop without the need of using a pump to push the working medium. Nowadays, many literatures about the...

Claims

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Application Information

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IPC IPC(8): F28D15/02F28D1/02F28F1/04F28F1/40
CPCF28D15/0275F28D15/0266F28D1/0233F28F2215/02F28F1/40F28D2021/0064F28F1/04F28D1/0226F28D1/0476F28D1/05366F28D2021/0028F28F1/24F28F2009/0292H01L23/3672H01L23/427H05K7/20309H05K7/20318
Inventor CHEN, CHIEN-ANFAN, MU-SHUCHEN, CHIEN-YU
Owner AURAS TECH