Resin composition and article made therefrom
a technology of resin composition and composition, applied in the field of resin composition, can solve the problems of poor dimensional stability of polyphenylene oxide resins
Active Publication Date: 2020-04-09
ELITE MATERIAL
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- Abstract
- Description
- Claims
- Application Information
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Benefits of technology
The resin composition achieves significant improvements in thermal resistance, interlayer bonding strength, and dimensional stability, with a coefficient of thermal expansion below 35.0 ppm / °C, T288 thermal resistance greater than 70 minutes, and a Z-axis dimensional change ratio less than 1.80%, making it suitable for high-performance electronic components.
Problems solved by technology
However, currently available polyphenylene oxide resins fail to perform well in dimensional stability, so there is a need to propose a polyphenylene oxide resin composition capable of achieving satisfactory dimensional stability.
Method used
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[0012]To enable those skilled in the art to further appreciate the features and effects of the present disclosure, words and terms contained in the specification and appended claims are described and defined. Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by those of ordinary skill in the art to which this disclosure pertains. In the case of conflict, the present document and definitions contained herein will control.
[0013]As used herein, the term “comprises,”“comprising,”“includes,”“including,”“has,”“having” or any other variant thereof is construed as an open-ended transitional phrase intended to cover a non-exclusive inclusion. For example, a composition or article of manufacture that comprises a list of elements is not necessarily limited to only those elements but may include other elements not expressly listed or inherent to such composition or article of manufacture. Further, unless expressly stated to the...
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Abstract
A resin composition and an article made from the resin composition are disclosed. The resin composition comprises: a first vinyl-containing polyphenylene oxide resin, a prepolymer thereof or both; and a second vinyl-containing polyphenylene oxide resin or a prepolymer thereof; wherein the first vinyl-containing polyphenylene oxide resin has a number average molecular weight of between 500 and 1500, and the second vinyl-containing polyphenylene oxide resin has a number average molecular weight of between 1600 and 3500.
Description
CROSS-REFERENCE TO RELATED APPLICATION[0001]This application claims the priority benefits of Taiwan Patent Application No. 107135003, filed on Oct. 4, 2018. The entirety the above-mentioned patent application is hereby incorporated by reference herein and made a part of this specification.BACKGROUND1. Field of the Disclosure[0002]The present disclosure relates to a resin composition and more particularly to a resin composition comprising at least two vinyl-containing polyphenylene oxide resins with different molecular weight, which is used for making a prepreg, a resin film, a resin film with copper foil, a laminate or a printed circuit board.2. Description of Related Art[0003]With the rapid advancement of electronic technology, information processing in mobile communication, servers, cloud storage and other electronic products has been incessantly directed toward high frequency signal transmission and high speed digitalization, and low dielectric resin material has become the mains...
Claims
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IPC IPC(8): C08L71/12H05K1/03C08G65/48H01B3/42C08K3/013C08K5/00
CPCC08L71/126H05K1/0373C08G65/485C08G2650/36C08L2203/206C08K3/013C08K5/0025H01B3/427C08L71/12C08J5/18B32B5/02B32B15/14B32B15/20B32B33/00B32B17/061H05K1/0353B32B2262/101B32B2260/021B32B2260/046B32B2307/306B32B2457/08C08L2203/20C08J2371/12C08J2479/04C08L79/04C09D171/12H05K1/0326
Inventor HSU, CHING-HSIENTAN, KOK-SHENG
Owner ELITE MATERIAL