Positive photosensitive resin composition and method for forming patterns by using the same

a technology of resin composition and photosensitive resin, which is applied in the direction of photomechanical equipment, instruments, optics, etc., can solve the problems of reducing the resolution of the subsequent lithography process, the photoresist layer cannot block the reflected light of the metal circuit, and the photoresist pattern adhered to the metal circuit is easily decolored

a technology of resin composition and photosensitive resin, which is applied in the direction of photomechanical equipment, instruments, optics, etc., can solve the problems of reducing the resolution of the subsequent lithography process, the photoresist layer cannot block the reflected light of the metal circuit, and the photoresist pattern adhered to the metal circuit is easily decolored

US9188859B2Active Publication Date: 2015-11-17CHI MEI CORP
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  • Positive photosensitive resin composition and method for forming patterns by using the same
  • Positive photosensitive resin composition and method for forming patterns by using the same
  • Positive photosensitive resin composition and method for forming patterns by using the same

Examples

Experimental program
Comparison scheme
Effect test

synthesis example a-1-1

[0109]A 1000 mL four-necked conical flask equipped with a nitrogen inlet, a stirrer, a heater, a condenser and a thermometer was purged with nitrogen, and the following components were charged to the flask. The aforementioned components comprising 0.70 moles of m-cresol, 0.30 moles of p-cresol, 0.5 moles of 3,4-dihydroxybenzaldehyde and 0.020 moles of oxalic acid were stirred slowly and heated to 100° C., so as to carry out polycondensation for 6 hours. Next, the reaction was heated again to 180° C. and then dried under a decreased pressure at 10 mmHg for evaporating the solvent, thereby obtaining a hydroxy-type novolac resin (A-1-1).

synthesis examples a-1-2

to A-1-5

[0110]Synthesis Examples A-1-2 to A-1-5 were practiced with the same method as in Synthesis Example A-1-1 by using different kinds and different amounts of the components of the hydroxy-type novolac resin (A-1). The formulations of Synthesis Examples A-1-2 to A-1-5 were also listed in TABLE 1 rather than focusing or mentioning them in details.

synthesis examples a-2-1

to A-2-3

[0111]Synthesis Examples A-2-1 to A-2-3 were practiced with the same method as in Synthesis Example A-1 by using different kinds and different amounts of the components of the other hydroxy-type novolac resin (A-2). The formulations of Synthesis Examples A-2-1 to A-2-3 were also listed in TABLE 1 rather than focusing or mentioning them in details.

Preparation of Positive Photosensitive Resin Composition

[0112]The following examples are directed to the preparation of the positive photosensitive resin composition of Examples 1 to 13 and Comparative Examples 1 to 6 according to TABLES 2 and 3.

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Abstract

The present invention relates to a positive photosensitive resin composition and a method for forming patterns by using the same. The positive photosensitive resin composition includes a novolac resin (A), an ortho-naphthoquinone diazide sulfonic acid ester (B), a dye (C) and a solvent (D). The novolac resin (A) further includes hydroxy-type novolac resin (A-1), which is synthesized by condensing hydroxylbenzaldehyde compound with aromatic hydroxyl compound. The dye (C) includes at least one (C-1) selected from the group consisting of diazo dye, anthraquinone dye and chromium (III, Cr3+) azo dye, as well as triarylmethane dye (C-2). Since the positive photosensitive resin composition can form colorfully fine patterns on metal circuits, and such patterns are not decolored after being etched, thereby beneficially blocking the reflected light of the metal circuits.

Description

RELATED APPLICATIONS[0001]This application claims priority to Taiwan Application Serial Number 101131364, filed on Aug. 29, 2012 which is herein incorporated by reference.BACKGROUND[0002]1. Field of Invention[0003]The present invention relates to a positive photosensitive resin composition and a method for forming patterns by using the same. More particularly, the present invention relates to a positive photosensitive resin composition for forming colorfully fine patterns on metal circuits, wherein such patterns are not decolored after being etched, thereby beneficially blocking the reflected light of the metal circuits during a manufacturing process of a semiconductor integrated circuit device, a thin film transistor-liquid crystal display (TFT-LCD) device or a touch panel.[0004]2. Description of Related Art[0005]Depending upon the microminiaturization of various electronic products in daily life, the demand for high resolution in various smart phones, slim TVs and microprocessors ...

Claims

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Application Information

Patent Timeline
17 Nov 2015
Publication
US9188859B2
IPC
G03F7/023; G02F1/136; G03F7/20; G03F7/022; C08G8/24; G03F7/038; H01L29/786
CPC
G03F7/022; G02F1/136; G03F7/0226; G03F7/0236; G03F7/20; H01L29/786
Inventors
CHEN, KAI-MIN; SHIH, CHUN-AN