The invention relates to the technical field of
diode gluing, in particular to a gluing device for
diode processing, a glue layer is shifted through a soft rod, so that the glue layer flows again to cover the inner wall of a mold frame, and the problem that the inner wall of the mold frame is insufficiently filled with glue is avoided. Therefore, the problem that the glue layer insufficiently covers the
diode is avoided, and meanwhile, when the soft rod is in contact with the diode, the soft rod can generate adaptive deformation to pass through the diode, so that the collision phenomenon is avoided, and the diode is prevented from being damaged; a gluing device for diode
processing comprises a cylinder, a
piston, a first hard rod, a soft rod, a sealing
assembly and a lifting
assembly. The dispensing head is communicated with a cylinder, and the cylinder is screwed with the connector; at least two round holes are formed in the cylinder, and the round holes are communicated with the corresponding channels I; a
piston is slidably connected to the cylinder; a first hard rod is fixedly connected to the
piston and located on the inner side of the dispensing head.