Alloy, method for preparing the alloy, and method for producing ornamental article

Abstract

This invention provides an alloy, its preparation method and method for producing ornaments from the alloy. When the alloy is used as Pt ornaments solder, it is composed of Pt 89.5-90.5 parts, In 3 parts, Ga 3 parts and Cu 3.5-4.5 parts, and is prepared by smelting in a smelter. When the alloy is used as Pd ornaments solder, it is composed of Pd 97.5-98.5 parts, in 0.4-1.4 parts, Ga 0.85 part and Fe 0.25 part, and is prepared by smelting in a smelter. This invention avoids the problem of soldering effect due to small melting point difference between the solder and the bonded raw materials.

Description

technical field [0001] The invention relates to the technical field of precious metal processing, especially alloys, methods for preparing the alloys and methods for producing ornaments Background technique [0002] In the field of precious metal processing, a large amount of solder is used in the preparation process of jewelry, and the solder used accounts for 30%-40% of the final product. If the melting point temperature of the solder used in the preparation of precious metal jewelry is different from that of the precious metal chain body Not much, the solder and the chain body melt together during welding, which affects the subsequent production and processing of the product, and then affects the product quality of the jewelry. [0003] In the prior art, the solder of platinum ornaments has a ratio of 67 parts by weight, 15 parts of palladium, and 18 parts of silver. The melting point of the solder is 900 to 950 degrees Celsius, and the melting point of platinum is Celsi...

AI Technical Summary

Problems solved by technology

[0002] In the field of precious metal processing, a large amount of solder is used in the preparation process of jewelry, and the solder used accounts for 30%-40% of the final product. If the melting point temperature of the solder used in the preparation of precious metal jewelry is different from that of the precious metal chain body Not much, the solder and the chain body melt together during welding, which affects the subsequent production and processing of the product, which in turn affects the product quality of the jewelry

[0003] In the prior art, the solder of platinum ornaments has a ratio of 67 parts by weight, 15 parts of palladium, and 18 parts of silver. The melting point of the solder is 900 to 950 degrees Celsius, and the melting point of platinum is Celsius temperature: 1752 degrees, the melting point temperature of platinum jewelry solder is quite different from that of platinum, but the solder of platinum jewelry does not contain platinum, which affects the fineness of platinum jewelry

[0004] Solder for palladium jewelry, the distribution ratio by weight is: 60 parts of palladium, 36.5 parts of silver, and 3.5 parts of brass. The melting point of the solder is Celsius: 1000 to 1100 degrees. The melting point of palladium is Celsius : 1550 degrees, the melting point temperature of palladium gold jewelry solder is very different from that of palladium gold, but the content of palladium in the solder of palladium gold jewelry is not very high, which affects the fineness of palladium gold jewelry