Latching micro magnetic relay packages and methods of packaging

A technology of components and devices, applied in the field of miniature magnetic latching relays

Inactive Publication Date: 2008-12-03
约翰・斯塔福德 +2
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Additionally, the materials that can be used as substrates for MEMS

Method used

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  • Latching micro magnetic relay packages and methods of packaging
  • Latching micro magnetic relay packages and methods of packaging
  • Latching micro magnetic relay packages and methods of packaging

Examples

Experimental program
Comparison scheme
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Embodiment Construction

[0025] Referring now to FIG. 1, there is illustrated a wafer-scale assembly 10 of a miniature magnetic latching relay or other MEMS structure incorporating a magnet or other thermally sensitive element. As described below, a major advantage of assembly 10 is that it can be assembled using solder ingots and cryogenic equipment. It is desirable to use cryogenic devices because magnets incorporated into MEMS structures can be easily damaged by too much heat.

[0026] As will be apparent from the following discussion, assembly 10 can be fabricated in a wafer format without requiring the MEMS devices to be individually assembled into a single assembly. In conjunction with the description of the structures above, typically multiple MEMS devices are formed simultaneously on a single wafer. Labor costs can be high if the wafer must be separated into individual MEMS devices and each individual device assembled separately.

[0027] In this particular embodiment, a gallium arsenide sub...

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Abstract

A method of forming a hermetically sealed MEMS package includes a step of providing a supporting GaAs substrate with at least one contact for the MEMS device on the surface of the supporting substrate and forming a cantilever on the surface of the supporting substrate positioned to come into electrical engagement with the contact in one orientation. A metal seal ring is fixed to the surface of the supporting substrate circumferentially around the contact and the cantilever. A cavity is etched in a silicon chip to form a cap member. A metal seal ring is fixed to the cap member around the cavity. The package is hermetically sealed by reflowing a solder alloy, positioned between the two seal rings, in an inert environment without the use of flux.

Description

technical field [0001] The invention relates to a miniature magnetic latching relay. [0002] In particular, the present invention relates to packaging methods and various assemblies of miniature magnetic latching relays. Background technique [0003] Recently, a new type of miniature magnetic latching relay was discovered. The new miniature magnetic latching relay is based on the preferential magnetization of a soft magnetic cantilever in a permanent external magnetic field. Switching between the two magnetic states is accomplished by instantaneously changing the magnetization direction of the cantilever with a short current pulse through a planar coil adjacent to the cantilever. Once the relay switches, it is held in this non-volatile state (latching state) by a permanent external magnetic field. Additional construction and operation information regarding this new miniature magnetic latching relay is in copending U.S. Patent Application Serial No. 09 / 496,446, filed Febr...

Claims

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Application Information

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IPC IPC(8): H05K3/02B23K31/02B23K101/40B81B7/00H01H1/00H01H36/00H01H49/00H01H50/00H01H51/24H01L23/10
CPCH01H36/0006H01L2924/01074H01L2924/09701H01L2924/10329H01L2924/01024H01H2050/007B81B7/0077H01L2924/01013H01H2036/0093H01H1/0036H01L23/10H01L24/97H01L2924/30105H01L2924/10253H01L2924/01006H01L2924/01078H01L2924/01033H01H50/005H01L2924/01079H01L2924/1461H01L2924/12042H01L2924/00
Inventor 约翰·斯塔福德戈登·塔姆申军
Owner 约翰・斯塔福德
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