Mesothermal copper based solder without cadmium, and preparation method
A copper-based, medium-temperature technology
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specific Embodiment approach 1
[0004] Embodiment 1: The medium-temperature copper-based cadmium-free solder of this embodiment is made of the following components by weight percentage: Cu: 74.9-82.96%, Ni: 1-5.5%, Sn: 10-12%, P: 6- 7%, Ce: 0.02-0.3%, La: 0.02-0.3%.
specific Embodiment approach 2
[0005] Embodiment 2: The medium-temperature copper-based cadmium-free solder of this embodiment is made of the following components by weight percentage: Cu: 79.52%, Ni: 1.1%, Sn: 11.9%, P: 6.9%, Ce: 0.29%, La: 0.29%.
specific Embodiment approach 3
[0006] Specific embodiment three: The medium-temperature copper-based cadmium-free solder of this embodiment is made of the following components by weight percentage: Cu: 78.24%, Ni: 5.4%, Sn: 10.2%, P: 6.1%, Ce: 0.03%, La: 0.03%.
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