High contrast electroluminescent device

Abstract

The device comprises back electrode, electron transport layer, luminous layer, hole transport layer, transparence electrode, extinction interference layer and glass basal plate. The extinction interference layer can be positioned between the transparence electrode and transparent substrate, or in front of the transparent substrate, or in rear of transparent substrate or in rear of main luminous layer. Organic electroluminescence device positioned at side of extinction interference layer or transparent electrode. The extinction interference layer comprises periodical structure composed of three layers: low reflectivity film, transition layer film and high reflectivity film. The invention provides high contrast and lowers cost without changing technique.

Description

Technical field [0001] The invention relates to a display device, in particular to a high-contrast electroluminescent device lighting technology device. Background technique [0002] The basic structure of a commonly used electroluminescent device includes a transparent electrode, a light-emitting layer (organic layer or an inorganic layer) and a metal electrode. When a voltage or current is applied, the light-emitting layer emits light of various colors and enters the observer's eye through the transparent electrode. Eye. The external background light will produce strong reflection on the interface between the luminescent layer and the metal electrode, and this part of the emitted light will enter the eyes of the observer, which will make the contrast of the display device significantly low under the condition of strong external background light, which will seriously affect the display effect of the display. . The contrast ratio of common electroluminescent devices is 5:1...

AI Technical Summary

Problems solved by technology

[0008] If the extinction interference layer is made behind the light-emitting layer, here, the extinction interference layer is made of an attached Figure 5 9 in the composition, because the extinction interference layer is generally deposited by sputtering and other methods, it is very likely to damage the light-emitting layer during the production process, which has a particularly serious impact on organic electroluminescent devices, increasing the difficulty of the production process

Moreover, it is necessary to consider the matching relationship between the work function of the extinction interference layer and the LUMO energy level of the light-emitting layer or the transmission layer. This requires changing the work function of the extinction interference layer by changing the stoichiometric ratio, which increases the difficulty of the manufacturing process.

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