Shape memory low temperature high shrinking film and its preparation method
A high-shrinkage, low-temperature technology, applied to flexible coverings, packaging, wrapping paper, etc., can solve the problems of damaging the appearance of fresh meat, large equipment investment, and difficult processing
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specific Embodiment approach 1
[0005] Embodiment 1: The heat-shrinkable film of this embodiment is made of a shape-memory polymer that is blown at 175-190°C and then cooled to ≤40°C, then heated to 50-85°C and biaxially stretched, then cooled and shaped to ≤ It is made by winding at a temperature of 50°C, and the shape memory polymer includes polyvinyl lactone (PCL), carbon dioxide polymer (PPC), styrene-butadiene polymer (SB), polyvinyl butyrate Aldehyde (PVB), polylactic acid (PLA), polyvinyl alcohol (PVA), ethylene vinyl alcohol polymer (EVOH) or modified polyolefin (PO).
specific Embodiment approach 2
[0006] Embodiment 2: The shape memory low-temperature high-shrinkage film of this embodiment is a single-material single-layer film or a single-material multilayer film, and the structure is A material layer, B material layer and A material layer, or A material layer , B material layer and C material layer, or A material layer, B material layer, C material layer, B material layer and A material layer, or A material layer, B material layer, C material layer, D material layer, E Material layer and F material layer. Other methods and structures are the same as in the first embodiment. (Different letters in this embodiment represent different materials.)
specific Embodiment approach 3
[0007] Specific embodiment three: the shape-memory low-temperature high-shrinkage film of this embodiment is a multi-material, multi-layer barrier film (or functional film), and the three-layer structure is A material, B material and A material as the first layer, PLA material , SB material, PLASB material, PLA material and SB material as the second layer, A material, B material, C material, PLA material, adhesive resin and PO material as the third layer, or SB as the first layer, adhesive resin is the second layer, PO is the third layer; five or more layers are any one of a certain polymer multilayer, and the barrier layer can be one or any multilayer, and one outer layer is heat-sealed layer, PLA or SB, adhesive resin, EVOH or / and PVA, adhesive resin, PO. Other methods and structures are the same as in the first embodiment.
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