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Vacuum drying device and drying method for substrate

A decompression drying device and substrate technology, which is applied in the direction of drying solid materials, coating liquid on the surface, drying solid materials without heating, etc., can solve the problems of heat capacity difference, affecting the state of processing liquid, and generating temperature difference, etc., to achieve Effects of preventing unevenness, preventing unevenness of the treatment liquid, and simplifying the structure of the device

Inactive Publication Date: 2009-07-22
DAINIPPON SCREEN MTG CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, in reduced pressure drying, if the substrate is supported at points, there will be a temperature difference between the supporting part and other parts.
This is because, although the heat of vaporization is taken away from the substrate with the vaporization of the treatment liquid in reduced-pressure drying, a substantial difference in heat capacity occurs between the support portion and other portions, or a heat capacity is generated in the space other than the support portion. Airflow takes away heat, etc.
[0005] In this way, if a local temperature difference occurs on the substrate, it will affect the state of the processing liquid on the substrate, thereby causing unevenness of the processing liquid.

Method used

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  • Vacuum drying device and drying method for substrate
  • Vacuum drying device and drying method for substrate
  • Vacuum drying device and drying method for substrate

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no. 1 approach

[0063] figure 1 It is a figure which shows the schematic structure of the vacuum drying apparatus 1a which concerns on 1st Embodiment. This decompression drying apparatus 1a has a function of drying the resist liquid etc. applied on the substrate W by decompressing the gas atmosphere in the processing chamber 20 in the state where the substrate W is arranged in the processing chamber 20. treatment fluid.

[0064] The reduced-pressure drying apparatus 1a has a chamber 2 forming a processing chamber 20 for processing a substrate W. As shown in FIG. The chamber 2 is composed of a detachable base body 21 and a cover body 22 . The base body 21 is fixedly arranged, while the lid body 22 is connected to the hanging arm 23 , and can be raised and lowered relative to the base body 21 by driving the hanging arm 23 . In addition, in the following description, unless otherwise specified, the relative motion of each member will be described based on the base body 21 fixedly arranged to ...

no. 2 approach

[0083] Next, a second embodiment will be described. In the first embodiment, the support surface for drying the substrate and the support surface for transferring the substrate are constituted by the same member, and support the entire rear side of the product area also when transferring the substrate. However, in recent years, the size of the substrate has gradually increased, and since the non-product region supporting only the edge of the substrate causes the substrate to bend, the transport mechanism may also support the back side of the product region near the center of the substrate. In this case, as in the first embodiment, when transferring the substrate to and from the transfer mechanism, it is impossible to support the entire back side of the product region of the substrate. The reduced-pressure drying device of the second embodiment was developed for such a transport mechanism.

[0084] Fig. 6 is a diagram showing a schematic configuration of a reduced-pressure dry...

no. 3 approach

[0117] Next, a third embodiment will be described. Figure 13 It is a figure which shows the schematic structure of the vacuum drying apparatus 201a which concerns on 3rd Embodiment. The decompression drying device 201a has a function of decompressing the gas atmosphere in the processing chamber 220 and drying the processing liquid such as resist applied on the substrate W while the substrate W is arranged in the processing chamber 220 .

[0118] The reduced-pressure drying apparatus 201a has a chamber 202 forming a processing chamber 220 for processing a substrate W. As shown in FIG. The chamber 202 is composed of a detachable base body 221 and a cover body 222 . The base body 221 is fixedly arranged. On the other hand, the cover body 222 is connected to the hanging arm 223 , and can be moved up and down relative to the base body 221 by driving the hanging arm 223 . In addition, in the following description, unless otherwise specified, the relative motion of each member wil...

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Abstract

The present invention provides a reduced-pressure drying device for preventing unevenness of the treatment liquid when the treatment liquid on the substrate is dried. This reduced-pressure drying device has two support plates that can be raised and lowered and three fixed plates that are fixedly arranged. During the drying process, the height of the upper surface of the supporting plate is consistent with that of the fixing plate, forming a supporting surface for supporting the substrate. During the drying process, the support surface contacts the entire back side of the substrate to support the substrate. Therefore, no space is formed on the rear side of the substrate, no airflow is generated, and unevenness of the treatment liquid can be prevented. In addition, when the substrate is delivered, the support plate is lifted up, and the upper surface of the support plate surface-contacts the back side of the substrate to support the substrate. Therefore, it is not necessary to form through-holes for support pins, etc., the device structure can be simplified, and unevenness of the treatment liquid caused by the through-holes can be prevented.

Description

technical field [0001] The invention relates to a decompression drying device for decompressing the gas environment in a processing chamber to dry a processing liquid on a substrate. Background technique [0002] In the manufacturing process of various substrates such as glass square substrates for liquid crystals, semiconductor substrates, flexible substrates for thin-film liquid crystals, photomask substrates, and color filter substrates, it is necessary to apply resist liquid on the surface of the substrate, etc. treatment of the treatment liquid, and use a drying device to dry the treatment liquid on the substrate. As the drying apparatus, known is a decompression drying apparatus that depressurizes the gas atmosphere in the processing chamber holding the substrate to lower the boiling point of the processing liquid and dry the processing liquid on the substrate in a relatively short period of time (for example, refer to Patent Document 1). [0003] Patent Document 1: ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/027F26B5/04F26B25/00B05D3/12
Inventor 柿村崇
Owner DAINIPPON SCREEN MTG CO LTD