Insulating pattern and method of forming the same

An insulating pattern and pattern technology, applied in the direction of pattern and lithography, electrical components, printed circuit manufacturing, etc., can solve the problems of pattern printing that cannot correspond to high-definition patterns, increased material costs, and reduced operability.

Inactive Publication Date: 2009-08-05
TAIYO HLDG CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0010] Use the same composition to form a pattern by screen printing. If a pattern without undercuts is formed, the chipping of the solder resist during soldering or plating will be improved, but pattern printing cannot correspond to high-definition patterns.
[0011] In terms of obtaining high-definition patterns without undercutting, it is very effective to improve the deep curability of the solder resist composition of the photographic development method, but the increase in the amount of acrylate compound in the photosensitive component will be due to the viscosity of the dry coating film ( tack) reduces operability, and the increase in photopolymerization initiators will lead to an increase in material costs

Method used

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  • Insulating pattern and method of forming the same
  • Insulating pattern and method of forming the same
  • Insulating pattern and method of forming the same

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0075] 100 parts by mass of carboxyl-containing copolymer resin (trade name: Cycroma-P250) produced by Diacel Chemical Industry Co., Ltd., 75 parts by mass of propylene glycol monomethyl ether, and silicone compound (trade name: KS-66) produced by Shin-Etsu Chemical Co., Ltd. 2 The parts by mass were fully mixed to obtain the alkali-soluble repellent A-1.

[0076] The obtained repellent A-1 was applied on the circuit-formed FR-4 substrate in a pattern reciprocal to the solder resist pattern using an inkjet printer, and dried and cured at 80° C. for 10 minutes.

Embodiment 2

[0078] 100 parts by mass of carboxyl-containing copolymer resin (trade name: Cycroma-P250) produced by Diacel Chemical Industry Co., 75 parts by mass of propylene glycol monomethyl ether, silicone compound (trade name: FS-1265-1000) produced by Toray DowCorning Silicone Co. ) 2 parts by mass were fully mixed to obtain alkali-soluble repellent A-2.

[0079] The obtained repellent A-2 was applied on the circuit-formed FR-4 substrate in a pattern reciprocal to the solder resist pattern using an inkjet printer, and dried and cured at 80° C. for 10 minutes.

Embodiment 3

[0081] 100 parts by mass of carboxyl-containing copolymer resin (trade name: Cycroma-P250) produced by Diacel Chemical Industry Co., 75 parts by mass of propylene glycol monomethyl ether, silicone grafted acrylic resin (trade name: X- 22-8195) 100 parts by mass were fully mixed to obtain alkali-soluble repellent A-3.

[0082] The obtained repellent A-3 was applied on the circuit-formed FR-4 substrate in a pattern reciprocal to the solder resist pattern using an inkjet printer, and dried and cured at 80° C. for 10 minutes.

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PUM

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Abstract

The present invention provides a method for forming an insulating pattern, which is characterized in that: (1) on a substrate on which a circuit is formed, a repellent (A) is applied and fixed on a pattern that is in a complementary relationship with the insulating layer pattern; process; (2) a process of applying a liquid insulating resin composition (B) having a surface tension higher than that of the fixed repellant (A) but lower than that of the substrate on the entire surface of the substrate obtained in the process (1); and ( 3) A step of fixing the coating film of the liquid insulating resin composition (B) obtained in step (2) on the substrate by curing by active energy ray irradiation and / or heating, or by heating and drying to form an insulating layer. In the steps (2) to (3) above, the liquid insulating resin composition (B) is repelled by the fixed matter of the repelling agent (A) to obtain an insulating pattern.

Description

technical field [0001] The present invention relates to an insulating pattern and a method for forming the same, in particular to a technique for forming an insulating pattern such as a solder resist using a repellent. Background technique [0002] Solder resist ink (solder resist ink) is a product aimed at preventing solder bridges and protecting circuits when soldering components on printed wiring boards. Selective circuits that must be protected are selected by screen printing, etc. It can be covered by light curing, heat curing, etc. to make it have protective properties. On the other hand, mounting components are soldered to uncovered but selectively exposed portions. In addition, although the leads of the mounted components are mounted on the printed wiring board with solder, the area of ​​the portion selectively exposed without being covered with the solder resist is generally smaller than the area covered with the solder resist. [0003] Usually, a liquid compositi...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K3/28
CPCH05K2203/0582H05K2203/0759H05K2203/1173H05K3/28
Inventor 小岛秀明糸川弦柿沼正久
Owner TAIYO HLDG CO LTD
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