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Device and method for increasing tool utilization/reduction in MWBC for UV curing chamber

A lining, workpiece technology applied in the field of devices and methods for increased equipment availability/MWBC reduction for UV curing chambers, capable of solving problems such as equipment downtime and decreased manufacturing output

Active Publication Date: 2010-01-06
APPLIED MATERIALS INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

Also, the build-up of these substances on the surface requires periodic cleaning of the chamber surfaces, such as after every 200 wafers processed, which results in significant equipment downtime and a corresponding decrease in manufacturing throughput

Method used

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  • Device and method for increasing tool utilization/reduction in MWBC for UV curing chamber
  • Device and method for increasing tool utilization/reduction in MWBC for UV curing chamber
  • Device and method for increasing tool utilization/reduction in MWBC for UV curing chamber

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Embodiment Construction

[0019] Systems and methods according to various embodiments of the present invention overcome limitations in existing annealing, curing, and other processing systems by providing a removal mechanism for outgassing species before they can accumulate on the surfaces of the processing chamber. THE FOREGOING AND OTHER DEFECTS. In some embodiments, a pump liner or other element for creating a flow of purge gas may be used in a chamber, such as a vacuum chamber, to direct a substantially laminar flow of gas through a wafer or other workpiece during a process such as a UV curing process. surface. Such a flow will carry away any material introduced by the outgassing of the workpiece. The liner can be heated passively by convection in the chamber and the curing light source so that matter does not collect on the liner and can be efficiently removed from the chamber. In one embodiment, the pump liner is anodized to increase the absorption efficiency of the liner. To provide additiona...

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Abstract

The present invention discloses a pump liner for directing a laminar flow of purge gas across a workpiece to remove contaminants or species outgassed or otherwise produced by the workpiece during processing. The pump liner can take the form of a ring having a plurality of injection ports, such as slits of a variety of shapes and / or sizes, opposite a plurality of receiving ports in order to provide the laminar flow. The flow of purge gas is sufficient to carry a contaminant or outgassed species from the processing chamber in order to prevent the collection of the contaminants on components of the chamber. The pump liner can be heated, via conduction and irradiation from a radiation source, for example, in order to prevent the condensation of species on the liner. The pump liner also can be anodized or otherwise processed in order to increase the emissivity of the liner.

Description

Background technique [0001] such as silicon oxide (SiO x ), silicon carbide (SiC) and carbon-doped silicon oxide (SiOC x ) film materials are widely used in the manufacture of semiconductor devices. One method of forming such silicon-containing films on semiconductor substrates is by an in-chamber chemical vapor deposition (CVD) process. For example, a chemical reaction between a silicon supply and an oxygen supply can result in the deposition of solid phase silicon oxide on top of a semiconductor substrate disposed in a CVD chamber. As another example, silicon carbide and carbon doped silicon oxide films may be formed by a CVD reaction including an organic silicon source having at least one Si-C junction. [0002] Water is often a by-product of the CVD reaction of organosilicon compounds. Thus, water can be physically absorbed into the film as moisture, or chemically bonded into the deposited film as Si-OH. Any of these forms of water binding are generally undesirable. ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/00H01L21/268H01L21/3105C23C16/56
Inventor 胡安·卡洛斯·罗奇-阿尔维斯托马斯·诺瓦克萨尼夫·巴鲁贾安德兹·卡祖巴恩德卡·O·米科蒂
Owner APPLIED MATERIALS INC