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Heat radiation substrate

A technology for heat-dissipating substrates and boards, which is applied in the directions of circuit substrate materials, cooling/ventilation/heating transformation, and printed circuit components, etc., can solve the problems of reduced operating efficiency, damage, and inability of the electronic components 70 to dissipate heat, etc.

Inactive Publication Date: 2007-08-01
高陆股份有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0004] Please refer to Fig. 2, the aforesaid printed circuit board generally includes a board body 50, the board body 50 can provide a plane for copper foil to be laid on its surface to form a circuit 60, and the aforementioned board body 50, its material is generally plastic Made of heat-resistant materials, such as: FR4, FR5, epoxy resin, silicon, etc., although the board body 50 can be insulated from the circuit 60 on its surface, and can withstand high temperature, it cannot mount the electronic components 70 on its surface. Heat dissipation, if the electronic component 70 on its surface emits more heat when it operates, and there is no corresponding heat dissipation system to dissipate heat, the electronic component 70 will reduce the operating efficiency or cause damage due to the increase in temperature

Method used

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  • Heat radiation substrate

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Embodiment Construction

[0016] Please refer to FIG. 1, the heat dissipation substrate of the present invention includes a plate body 10 and an insulating and thermally conductive layer 20, wherein the plate body 10 is made of a metal material with high thermal conductivity (such as copper, aluminum); and The insulating and heat-conducting layer 20 is formed by coating a layer of insulating and heat-conducting glue on the surface of the board body 10, and baking it to solidify and form.

[0017] The copper foil can be laid on the surface of the insulating and thermally conductive layer 20, the circuit 30 is formed by etching or other methods, and then the pin 41 of a light-emitting diode 40 is connected to the circuit 30, then the light-emitting diode 40 can be located in the heat sink of the present invention. The surface of the substrate emits light; wherein the board body 10 is insulated from the circuit 30 and the light emitting diode 40 by the insulating and thermally conductive layer 20 to avoid cur...

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Abstract

The related heat dispersion base plate is characteristic in that, using high-conductive metal material (such as Cu and Al) instead of prior art, forming an insulation heat conductive layer to prevent the leakage from line or electric assembly on base plate surface to plate leading short circuit. This invention conducts heat of electric assembly into plate body for cooling.

Description

Technical field [0001] The present invention relates to a printed circuit board, in particular to a substrate with a metal plate body, which can provide a good heat dissipation effect of electronic components on the surface. Background technique [0002] The circuit conduction between electronic components in the early electronic devices generally used manual welding to connect metal lines to the contacts of each electronic component, so that the metal lines conduct current between the electronic components to achieve action. However, with the advancement of science and technology, the functions of electronic devices have improved with each passing day. On the contrary, the number of electronic components in electronic devices has become more and more dense. If you want to manually solder metal lines between electronic components, Not only does it take a relatively high time and labor cost, but the electronic components connected to each other are also prone to short-circuit due ...

Claims

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Application Information

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IPC IPC(8): H05K1/05H05K7/20H01L23/36
Inventor 郭礼维
Owner 高陆股份有限公司