Pulsating heat pipe heating panel using microcapsule phase-change thermal storage fluid as operating means

Abstract

The invention discloses a pulse heat tube radiating plate which uses the phase-variable fluid of micro capsule as work medium, comprising a base plate (1) and a cover plate (4) to form a sealed chamber. The base plate (1) is arranged with a curved groove (2) with at least two bended heads and the section diameter of groove is smaller than 2mm. the groove (2) contains the phase-variable fluid medium, while the groove (2) is communicated with the inlet (3) of base plate (1). The fluid medium is FS-39E micro capsule phase-variable material. The invention can avoid movable element and noise while it is driven by waste heat completely.

Description

technical field [0001] The invention relates to a heat pipe type cooling plate, in particular to a pulsating heat pipe type cooling plate using a microcapsule phase change thermal storage fluid as a working medium. Background technique [0002] With the continuous development of the electronic industry, the functions and complexity of electronic equipment are increasing day by day. Within a limited volume range, the power consumption of electronic equipment continues to increase, and the amount of heat dissipation increases sharply. Taking microelectronic chips as an example, the current heat flux has reached 60-90W / cm 2 , up to 200W / cm 2 . The traditional convective heat transfer method and forced air cooling method relying on single-phase fluid can only be used for heat flux density not greater than 10W / cm 2 For electronic devices, the heat flux has reached 600W / cm 2 The above situation has become impotent. The heat dissipation and cooling of electronic components has...

AI Technical Summary

Problems solved by technology

Due to the problem of unreliable long-term operation of the flow control valve, Akachi proposed a new loop heat pipe without a flow control valve in its 1993 patent (US5219020, 1993), and proposed two structures, an open loop and a closed loop. However, this structure directly installs the heat pipe into the chip, and the contact thermal resistance will be very large, which will affect the heat dissipation capability.

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