Method and equipment for disassembling circuit board using non-contacted impact

A non-contact, circuit board technology, used in welding equipment, metal processing equipment, printed circuits, etc., can solve the problems of small impact force, impossible to seal well, and inability to achieve effective disassembly, and achieve the effect of improving efficiency

Inactive Publication Date: 2007-08-08
TSINGHUA UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Its disadvantages are: due to its material characteristics (the base material is mainly made of epoxy resin, glass fiber, etc. through composite methods), it becomes soft at the melting temperature of the solder, and cannot provide a uniform response to all parts of the circuit board. Elasticity; and in order to obtain sufficient resilience, the impactor bracket must push the circuit board very high, which cannot be effectively disassembled for longer plug-in components
Its disadvantages are: because the circuit board cannot be well sealed when it is installed in the device, and there are many through holes such as mounting holes and pin jacks on the substrate itself, hot air is constantly blown into the surface of the circuit board. Under normal circumstances, the lower surface of the circuit board is not easy to generate a large negative pressure, so the removal effect of the plug-in components is not good
The disadvantage is that the circuit board needs to be clamped by the clamping device to turn it over, b...

Method used

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  • Method and equipment for disassembling circuit board using non-contacted impact
  • Method and equipment for disassembling circuit board using non-contacted impact
  • Method and equipment for disassembling circuit board using non-contacted impact

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0076] Example 1 According to the method, the waste circuit board with components on both sides is disassembled

[0077] Fig. 1: Flow chart of the method of the present invention. A method for disassembling a circuit board by non-contact impact, the method comprising the following steps:

[0078] 1) Take a waste circuit board with components on both sides (hereinafter referred to as the circuit board), and clean the circuit board such as dust removal and dirt removal; remove the components connected by non-welding methods such as buckle connection, direct insertion, and screw connection; Straighten the pins of the plug-in components to be removed on the circuit board so that they are basically perpendicular to the circuit board substrate; roughly determine the melting point temperature of the solder (solder paste) used for the circuit board according to the type of circuit board substrate and the model of the component ;Take the two opposite sides with the shortest side-to-si...

Embodiment 2

[0089] Fig. 2 is a schematic diagram of a dismantling device of the present invention. The dismantling equipment adopts the card groove fixing device to fix the circuit board. The heating zone is divided into two zones: the preheating zone and the solder melting heating zone. The cam mechanism and the spring energy storage method are used to store energy for the impact rod. Shaped impact structure implements non-contact impact on the circuit board, uses the blower to purge the components and solder, and uses the horizontal moving metal mesh belt to separate and collect the components and solder, so as to realize the insertion of components on the circuit board. Devices and SMD components are removed based on the integrity of their functions. This dismantling equipment can dismantle circuit boards with components on one or both sides.

[0090] For the convenience of description, the method and basic structure of the dismantling equipment will be described below according to th...

Embodiment 3

[0117] Fig. 3 is a schematic diagram of another dismantling device of the present invention. The dismantling device uses a card slot to fix the circuit board, sets a heating and heat preservation area, uses a cam mechanism and a spring energy storage method to store energy for the impact rod, and the impact rod implements non-contact impact on the circuit board through the strip impact structure connected to it. , use the scraper to sweep the components and solder, and use the inclined metal mesh belt to separate and collect the components and solder, so as to realize the integral removal of the plug-in components and SMT components on the circuit board based on functions . The dismantling device can dismantle circuit boards with components on one side and circuit boards with components on both sides.

[0118] For the convenience of description, the method and basic structure of the dismantling device will be described below according to the method steps of dismantling the ci...

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PUM

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Abstract

The invention relates to one method and device to process disable by contact impact on circuit board, which comprises the following steps: adopting u shape tank structure or card tank structure spring fix device circuit board; heating circuit board; through point or bar or plane impact structure to exert non-contact impact on circuit board; scripting, isolating, collection elements and welding; after cooling sorting the circuit board and elements. The invention device comprises the following parts: impact lever, point or bar or plane impact structure, compression spring, circuit board spring fix device, blower device and spring network.

Description

technical field [0001] The method and equipment for dismantling circuit boards by using non-contact impact, which relate to the method and realization device for the integral and non-destructive disassembly (or removal) of components from printed circuit boards based on function recovery, belonging to production and maintenance and waste recycling technologies. Background technique [0002] A printed circuit board (Printed Curcuit Board, referred to as PCB, or Printed Wiring Board, referred to as PWB) is an important part of electronic information products, household appliances, etc. my country is a major producer of circuit boards in the world, and tens of thousands of tons of waste circuit boards are produced in the production process every year; with the continuous upgrading of electronic and electrical products, a large number of electronic and electrical products have been eliminated, and printed circuit boards have also been abandoned. Due to the lack of proper recycl...

Claims

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Application Information

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IPC IPC(8): H05K3/00B23K1/018B25B27/14B25B27/00
CPCY02P70/10
Inventor 段广洪向东汪劲松杨继平
Owner TSINGHUA UNIV
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