Microspring laser processing method

A technology of laser processing and micro springs, which is applied in the direction of springs/shock absorbers, coil springs, mechanical equipment, etc., can solve the problems of difficult processing of materials, destruction of material properties, and inability to manufacture coil springs, etc.

Inactive Publication Date: 2007-08-29
JILIN UNIV
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Problems solved by technology

[0003] The traditional spring manufacturing technology is winding technology, and the spring winding method can be divided into cold rolling and hot rolling. Bad materials are difficult to process
The biggest disadvantage of the first two techniques for making microsprings is that they can only produce planar springs with a certain depth, but not helical springs.
The third technique is not suitable for the processing of special materials such as amorphous alloys because it will destroy the bulk material properties.
[0005] At present, there is a great demand for the production of high-strength microsprings, and amorphous alloys are important materials for producing such high-strength microsprings. The above method is processed into a spring

Method used

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  • Microspring laser processing method

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Embodiment 1

[0018] The method described in this patent will be described below by taking UV-YAG laser processing amorphous As-Se alloy helical microspring as an example.

[0019] Firstly, a cylindrical mold with a diameter of 50 μm and a length of 2 cm was made from a polymethyl methacrylate rod. Then a layer of 20 μm thick amorphous As-Se alloy film is coated on the mold by vacuum evaporation method. Fix the cylindrical mold on the micro-clamping device4.

[0020] As shown in Figure 1, the laser output from the UV-YAG laser first passes through a variable optical attenuation sheet to adjust the laser power; then uses a lens group to focus the light onto the surface of the microspring material to be processed. The mold to be processed is clamped by the micro-clamping device 4, and the micro-clamping device 4 is controlled by the micro-motor system 3, so that the mold and the micro-spring material move forward along the mold axis and rotate along the axis at the same time. The microsprin...

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Abstract

The invention belongs to the field of laser machining technique, relating to a method of machining micro springs by laser, firstly making cylindrical or conical moulds or moulds of other shapes with micron or milimeter radius, then using film forming method to make film on the mould surface with micro spring material; then making the mould advance axially and rotate round axis, focusing laser-emitted laser spot on the micro spring material or making the mould only rotate to make the focused spot of the laser advance along the axis of the mould, controlling the output power amplitude and focused spot size of the laser, and thus carving spiral hollowed-out lines with a certain width on the micro spring material; and finally removing the internal mould to be able to obtain the required spring. And it can make 3D spiral machining, and machine high-rigidity materials and low plasticity materials, able to keep body material characteristic of micro spring and making the materials not change body characteristics because of melting and stretching operations and other operations.

Description

technical field [0001] The invention belongs to the technical field of laser processing, and in particular relates to a method for processing a microspring by using a laser. Background technique [0002] Micro springs refer to small springs with a helical outer diameter of less than 1 mm to distinguish them from general macros (Macro), that is, traditional springs larger than 1 mm. With the development of precision instruments, there is an increasing demand for microsprings with small size, light weight and high stiffness in aviation, aerospace, automobiles, biomedicine, environmental monitoring, military and other fields, and the processing technology of microsprings is also proposed. new challenges. [0003] The traditional spring manufacturing technology is winding technology, and the spring winding method can be divided into cold rolling and hot rolling. Bad materials are difficult to process. The micro-spring cold extrusion machine of Kenifer Group Corporation of the...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): F16F1/06
Inventor 孙洪波
Owner JILIN UNIV
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