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Method for coating substrates containing antimony compounds with tin and tin alloys

A technology of antimony compounds and tin alloys, which is applied in the direction of metal material coating process, coating, liquid chemical plating, etc., can solve the problems of insufficient properties of the end layer that can be joined, and achieve increased service life, excellent quality, and waste water problems The effect of solving

Inactive Publication Date: 2007-08-29
ATOTECH DEUT GMBH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Therefore, its properties as a bondable final layer are not sufficient
[0017] Also, the baths used to deposit tin and tin alloys cannot be used to produce metallized substrates after coating a few printed circuit boards
Therefore, the application of tin to CEM-1 printed circuit boards is unlikely to be a commercially reasonable application

Method used

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Examples

Experimental program
Comparison scheme
Effect test

example 1

[0048] Printed circuit boards made of CEM-1 material with dimensions 5×5 cm were treated with an aqueous solution containing 18% hydrochloric acid at a temperature of 50° C. for five minutes. Next, this material was treated with a microetching solution "Micro Etch SF" (obtained from Atotech, a sulfuric acid solution basically containing peroxodisulfate) at a temperature of 35° C. for one minute, and then used for electroless tin deposition by using The Atotech method achieves metallization with tin, the Atotech method consists of the following two steps:

[0049] 1. Treat with Stannadip F (essentially an acidic solution containing tin(II) methanesulfonate and thiourea) at room temperature for one minute;

[0050] 2. Treatment with Stannatech F (essentially an acidic solution containing tin(II) methanesulfonate and thiourea) at a temperature of 60°C for five minutes.

[0051] After treatment, the printed circuit boards were rinsed with demineralized water and dried at a temper...

example 2

[0055] Printed circuit boards made of CEM-1 material with dimensions 5×5 cm were treated with an aqueous solution containing 10% hydrochloric acid at a temperature of 60° C. for five minutes. Next, this material was treated with a microetch solution "Micro Etch SF" (from Atotech) at a temperature of 35° C. for one minute, and then metallized with tin by using the Atotech method for electroless tin deposition, which consisted of The following two steps:

[0056] 1. Treat with Stannadip F for one minute at room temperature;

[0057] 2. Treat with Stannatech F for five minutes at a temperature of 60°C.

[0058] After treatment, the printed circuit boards were rinsed with VE-water and dried at a temperature of 60°C.

[0059] The deposited tin layer showed a thickness of about 0.5 μm, good durability and good joining properties in terms of solderability.

[0060] The procedure was repeated five times in total. Thus, the grooves for chemically metallizing printed circuit boards ...

example 3

[0062] According to Example 1, a printed circuit board was pretreated with an aqueous solution containing 18% hydrochloric acid. A portion of the solution was continuously removed from the tank and passed through a column filled with copper particles. Therefore, antimony is deposited on the particle surface. When the copper surface was covered to a great extent with metallic antimony, the antimony was dissolved by treatment with Atotech micro etching solution "Micro Etch SF", the solution was removed from the column and provided for wastewater treatment. Using this method enabled the treatment of more than 50 printed circuit boards with the hydrochloric acid solution without replacing the solution.

[0063] The pretreated printed circuit boards were treated according to Example 1 or 2.

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Abstract

The present invention relates to a method for depositing tin or tin alloy layers on substrates containing antimony compounds as flameproofing agents or for improving the stampability, wherein the antimony compound is removed from the surface of the substrate material by an acid solution prior to metallization. Particularly preferred, pretreatment solutions containing hydrochloric acids are used for this purpose. The method is particularly suitable for producing joinable tin final layers on printed circuit boards containing antimony compounds, the tin final layers being applied onto copper portions of the conductor pattern which are not covered by the solder stop mask.

Description

technical field [0001] The present invention relates to a method for the electroless deposition of tin and tin alloy layers on substrates containing antimony compounds such as antimony trioxide. The method is particularly suitable for producing bondable tin and tin alloy finish layers on printed circuit boards containing antimony compounds to be applied to copper portions of conductors not covered by solder resist . The term "bondability" as used herein means the adhesiveness or solderability of a surface. Background technique [0002] Here, antimony compounds are used as flame retardants and improve punchability for producing vias. [0003] During the manufacture of printed circuit boards, in one of the final manufacturing steps, a final layer for creating bondability is applied to the copper portions of the conductors that are not covered by solder resist. Those parts of the printed circuit board which are not covered by the copper layer are in particular those surface ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C23C18/16C23C18/48C23C18/18H05K3/42
CPCC23C18/48C23C18/1844H05K3/244H05K2203/0392C23C18/16C23C18/18H05K3/42
Inventor 克里斯蒂安·楼因斯基汉斯-桔根·施如艾俄哲哈特·施戴贝格耶娜·诺厄门
Owner ATOTECH DEUT GMBH
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