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Light emitting device

A technology of light-emitting devices and light-emitting diodes, which is applied in the direction of electric solid-state devices, semiconductor devices, electrical components, etc., to achieve the effect of improving long-term reliability

Active Publication Date: 2007-10-03
TOYODA GOSEI CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0008] However, the light emitting device using LED elements in JP-A-02-298084 has only the advantage of using epoxy resin as a sealing material

Method used

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Experimental program
Comparison scheme
Effect test

no. 1 approach

[0032] Fig. 1A is a longitudinal cross-sectional view showing a surface-mounted light-emitting device in a first preferred embodiment of the present invention, Fig. 1B is a longitudinal cross-sectional view showing a light-emitting element, and Fig. 1C is an enlarged cross-sectional view showing a light emitting device in Fig. 1A lead part.

[0033] The light-emitting device 1 includes an LED element 2 formed by crystal growth of a GaN-based semiconductor layer on a sapphire substrate, a housing portion 3 formed of light-reflective white resin or ceramics, and an opening portion of the housing portion 3 in which the LED element 2 is placed is sealed. The resin sealing part 4 of the housing part 3 feeds electric power to the lead part 5 of the LED element 2 placed in the housing part 3, and the lead part 5 includes a silver plating layer formed on its surface as a reflective layer and on the surface of the reflective layer An organic thin film 50 formed of an organic compound a...

no. 2 approach

[0047] Fig. 2 is a longitudinal cross-sectional view showing a surface mount type light emitting device in a second preferred embodiment of the present invention.

[0048] The light-emitting device 1 of the second preferred embodiment differs from the device of the first preferred embodiment in that the device 1 comprises a reflective surface 30 inclined to the inside of the housing part 3, so that by reflecting light emitted from the LED element 2 and based on the angle of inclination The direction of the light entering the reflective surface 30 improves the output efficiency.

[0049] In addition, a light reflective film including a light reflective material such as aluminum (Al) may be formed on the light reflective surface 30 .

[0050] Advantages of the second embodiment

[0051] According to the second preferred embodiment of the present invention as described above, in addition to the advantageous advantages of the first preferred embodiment, the blue light emitted fro...

no. 3 approach

[0053] Fig. 3 is a longitudinal cross-sectional view showing a bullet-shaped light emitting device in a third preferred embodiment of the present invention.

[0054] The light emitting device 1 in the third preferred embodiment comprises lead parts 5A, 5B comprising a copper alloy excellent in thermal conductivity, the blue-emitting LED element 2 fixed to the cup-shaped part 56 formed on the lead part 5B by an embossing method, electrically connected The lead wires 6 of the electrode and lead parts 5A, 5B of the LED element 2 include a coating resin 560 containing siloxane of a phosphor 561 to emit yellow light when excited by blue light, and the coating resin 560 is sealed therein. The cup-shaped portion 56 of the LED element, and the resin sealing portion 4 comprising transparent and colorless epoxy resin, which integrally seal the lead portions 5A, 5B and the wire 6 .

[0055] The cup portion 56 includes a side wall portion 57 formed obliquely so as to reflect blue light em...

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PUM

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Abstract

A light emitting device has an LED (light emitting diode) element, and a power feeding member through which electrical power is fed to the LED element, the power feeding member comprising an electrically conductive material. The power feeding member has a light reflecting layer formed on the surface of the power feeding member, the light reflecting layer being formed of a metal, and a protecting layer formed on the surface of the light reflecting layer, the protecting layer being formed of an organic compound.

Description

[0001] This application is based on Japanese Patent Application No. 2006-089944 filed on March 29, 2006, the entire contents of which are incorporated herein by reference. technical field [0002] The present invention relates to a light emitting device formed of a light emitting diode (LED) and a power feeding member, wherein the power feeding member is used as a reflective layer and through which power is fed to the LED, and particularly relates to a light emitting device which is used in In the case of sealing the power feeding member using a silicone-based material, it is possible to prevent discoloration of the reflective layer to enhance long-term reliability of the light emitting device. Background technique [0003] Generally, a light-emitting element formed of gallium nitride (GaN) is considered as one of Group III nitride-based compound semiconductor light-emitting elements. Since GaN-type light-emitting elements have light-emitting properties from the ultraviolet ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L33/00H01L33/60H01L33/06H01L33/32H01L33/42H01L33/50H01L33/54H01L33/56H01L33/62
CPCH01L2924/01046H01L33/62H01L33/46H01L2224/48257H01L2924/01079H01L2224/48091H01L2224/73265H01L2924/01078H01L2224/49107H01L2224/32245H01L2924/01057H01L2924/01012H01L2224/48247H01L2924/12044H01L2924/00014H01L2924/00
Inventor 南侑村石田真
Owner TOYODA GOSEI CO LTD