Metal spraying material without lead

Abstract

This invention discloses a leadless sputtering material for end sputtering of metalized thin film capacitor. The leadless sputtering material comprises: Sn 40-79 wt.%, Sb 0.5-2 wt.%, Cu 0.01-0.5 wt.%, Al 1-15 wt.%, impurities less than or equal to 0.1 wt.%, and Zn as balance. Besides, mixed rare earth metals such as La and Ce 0.01-0.2 wt.%, preferential 0.1-0.15 wt.%, can also be added. The leadless sputtering material can be directly used for end sputtering of metalized thin film capacitor without the need for spraying a base layer first, which can largely simplify the spraying operation. The leadless sputtering material has high compatibility with present spraying apparatus and process.

Description

technical field [0001] The invention relates to a lead-free gold-spraying material, which belongs to the technical field of preparation of metal materials for spraying the end faces of metallized film capacitors. Background technique [0002] The gold-sprayed material on the end surface of the metallized film container (referred to as the gold-sprayed material) has been widely used, a typical example is a lead-based five-component gold-sprayed material, because it contains about 55% lead, it is in the global lead-free electronic components In the wave, it has basically been eliminated at present. A considerable number of manufacturers have replaced lead-based five-element gold spray materials with zinc wire, zinc-aluminum alloy wire and tin-zinc series alloy wire, because tin-zinc series alloys have the same properties as lead-based five-component alloys. Elemental gold-sprayed materials also have good end surface adhesion and superior welding performan...

AI Technical Summary

Problems solved by technology

[0002] The gold-sprayed material on the end surface of the metallized film container (referred to as the gold-sprayed material) has been widely used, a typical example is a lead-based five-component gold-sprayed material, because it contains about 55% lead, it is in the global lead-free electronic components In the wave, it has basically been eliminated at present. A considerable number of manufacturers have replaced lead-based five-element gold spray materials with zinc wire, zinc-aluminum alloy wire and tin-zinc series alloy wire, because tin-zinc series alloys have the same properties as lead-based five-component alloys. Elemental gold-sprayed materials also have good end surface adhesion and superior welding performance, and their melting points are lower than zinc wire and zinc-aluminum alloys. Therefore, tin-zinc series alloys have become the preferred gold-sprayed materials for capacitor manufacturers. For good contact with the thin-film metal evaporation layer, it is often necessary to spray a layer of pure zinc bottom layer first, and then spray a tin-zinc alloy surface layer, which can reduce the cost and meet the performance requirements of the capacitor, which increases the process. To complicate the process, Chinese patent ZL02111554.0 provides a tin-zinc series lead-free gold-spraying material, which has effectively solved the above problems, but as a lead-free gold-spraying material, it is still not enough in terms of melting point, price, performance, etc. Meet the requirements of the majority of capacitor manufacturers