High efficiency heat radiation cool plate for electronic device

A heat dissipation cold plate and electronic device technology, applied in the direction of electric solid devices, electrical components, semiconductor devices, etc., can solve the problems that affect the application of high-power electronic devices, low heat transfer efficiency of a single root, small effective heat transfer area, etc., to achieve Compact structure, reliable performance and long service life

Inactive Publication Date: 2007-10-10
SOUTH CHINA UNIV OF TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

At present, forced air-cooled radiators are generally used in combination with heat pipe technology, which can enhance the cooling capacity of air-cooled technology, but the heat pipe still has small effective heat transfer area, large thermal resistance with the radiator, low heat transfer efficiency of a single piece, and compactness. Problems such as poor performance affect its application in high-power electronic devices

Method used

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  • High efficiency heat radiation cool plate for electronic device
  • High efficiency heat radiation cool plate for electronic device
  • High efficiency heat radiation cool plate for electronic device

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0021] As shown in Figures 1 and 2, the high-efficiency heat dissipation cold plate for electronic devices has a length, width, and thickness of 80mm, 80mm, and 8mm, respectively, and is formed by bonding and welding the condensation plate 1 and the evaporation plate 2. The condensing plate 1 is formed on the surface of a smooth red copper substrate with a thickness of 3mm, and fine and dense three-dimensional sawtooth fins 4 are formed by a mechanical processing method of plow cutting and extrusion. The evaporation plate 2 is formed on the surface of a smooth red copper substrate with a thickness of 3mm, and a porous surface structure 5 with a bottom interconnected by capillary channels is formed by a mechanical processing method of plow cutting and extrusion. The evaporation surface of the high-efficiency heat dissipation cold plate is closely attached to the chip of the electronic device, and the condensation surface is closely attached to the forced convection electronic ra...

Embodiment 2

[0023] As shown in Figure 1 and Figure 2, the high-efficiency heat dissipation cold plate for electronic devices has a length, width and thickness of 60mm, 60mm and 7mm respectively, and is formed by bonding and welding the condensation plate 1 and the evaporation plate 2. The condensing plate 1 is formed on the surface of a smooth red copper substrate with a thickness of 2.5 cm to form fine and dense three-dimensional sawtooth fins 4 by a mechanical processing method of plow cutting and extrusion. The evaporation plate 2 is formed on the surface of a smooth red copper substrate with a thickness of 2.5mm, and a porous surface structure 5 with a bottom interconnected by capillary channels is formed by a mechanical processing method of plow cutting and extrusion. The evaporation surface of the high-efficiency heat dissipation cold plate is closely attached to the chip of the electronic device, and the condensation surface of the high-efficiency heat dissipation cold plate is clos...

Embodiment 3

[0025] As shown in Figures 1 and 2, the high-efficiency cooling plate for electronic devices has a length, width, and thickness of 50mm, 50mm, and 6mm, respectively, and is formed by bonding and welding the condensation plate 1 and the evaporation plate 2. The condensing plate 1 is formed on the surface of a smooth red copper substrate with a thickness of 2 cm, and fine and dense three-dimensional sawtooth fins 4 are formed by a mechanical processing method of plow cutting and extrusion. The evaporation plate 2 is formed on the surface of a smooth red copper substrate with a thickness of 2mm, and a porous surface structure 5 with a bottom interconnected by capillary channels is formed by a mechanical processing method of plow cutting and extrusion. The evaporation surface of the high-efficiency heat dissipation cold plate is closely attached to the chip of the electronic device, and the condensation surface is closely attached to the forced convection electronic radiator. The ...

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Abstract

The invention comprises: a cold plate with 3D saw tooth-like fins and a surface evaporation plate with multi holes whose bottoms are connected each other with micro channels; the cold plate with 3D saw tooth-like fins is welded with the surface evaporation plate to form a sealed room filled out with working materials. The 3D saw tooth -like fins triggers the turbulent motion of gas and enhances the condensation process; the multi holes structure improves the heat conduction efficiency.

Description

technical field [0001] The invention relates to heat dissipation technology of electronic devices, in particular to a high-efficiency heat dissipation cold plate for electronic devices. Background technique [0002] Electronic devices and chips need to work under certain temperature conditions. At the same time, electronic devices will generate a certain amount of heat when they are working, making their temperature continue to rise. The normal operating temperature range of electronic devices is generally -5~+65°C, and the maximum allowable operating temperature is 100~120°C. Too high or too low temperature will reduce the performance of electronic devices, and even cause damage to the device. To control electronic products to work within a certain temperature range, it is necessary to preheat and dissipate heat for some overheated chips or overheated device surfaces. With the rapid development of electronic technology, the high frequency and high speed of electronic devi...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K7/20H01L23/42
Inventor 高学农张正国陆应生方玉堂方晓明尹辉斌
Owner SOUTH CHINA UNIV OF TECH
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