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Catheter core mounting composition for semiconductor component, method of component mounting and semiconductor device

A technology of semiconductors and compositions, applied in semiconductor devices, semiconductor/solid-state device parts, semiconductor/solid-state device manufacturing, etc., can solve problems such as not expanding the size of silicon

Inactive Publication Date: 2007-10-17
UMICORE AG & CO KG
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, their use has not expanded to larger silicon sizes in larger power device packages

Method used

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  • Catheter core mounting composition for semiconductor component, method of component mounting and semiconductor device
  • Catheter core mounting composition for semiconductor component, method of component mounting and semiconductor device
  • Catheter core mounting composition for semiconductor component, method of component mounting and semiconductor device

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Experimental program
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Embodiment Construction

[0032] Table 1 lists various commercial copper powders combined with bisphenol F epoxy resins to form metal-filled bonding resins for temperature cycling tests and heat dissipation measurements.

[0033] All copper powders have spherical particles, a purity greater than 99.9%, and a thermal conductivity greater than 350 W / (m·K). Copper powders Cu1, Cu2, Cu3, Cu4 and Cu5 meet the requirements of the present invention, and for comparison reasons, copper powders Cu1C and Cu2C and commercial "High Thermal Conductivity Silver Filled Epoxy Paste" (Ag) were chosen. Two traditional high-lead solders Pb1(Pb 88 sn 10 Ag 2 ) and Pb 2 (Pb 92.5 sn 5 Ag 2.5 ) as a reference material.

[0034] Material

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Abstract

The Directive 2002 / 95 / EC of the European Parliament and of the Council promulgated that from 1 st July 2006 new electrical and electronic equipment must no longer contain lead. Accordingly, lead-free solder alloys for various electrical and electronic applications have been developed. But at present, lead in high melting temperature type solders, e.g. used for die-attach applications, are exempted from the directive due to lack of lead-free alternatives for these alloys. The present invention provides a lead-free die-attach composition for attaching high power semiconductor devices to printed circuit boards. The die-attach composition comprises a metal filled epoxy resin, wherein the metal is selected from a powder comprising copper and having spheroidal particles with less than half of the copper atoms in a surface layer being oxidized as measured by XPS.

Description

technical field [0001] The present invention provides lead-free adhesive compositions for die-attachment of high power semiconductors. Background technique [0002] According to Directive 2002 / 95 / EC of the European Parliament and of the Council, new electrical and electronic equipment placed on the market from July 1, 2006 must be free of lead and other toxic substances. This directive has led to the development of lead-free solder alloys for use in various electrical equipment. However, the Act still has some exemptions. Among other things, lead does not have to be substituted in these alloy solders (ie, lead-based alloys including 85% by weight or more lead) due to the lack of lead-free substitutes for high melting temperature type solders. This exemption has recently been confirmed by Commission Decision 2005 / 747 / EC of 21 October 2005. [0003] Lead-based solder alloys comprising more than 85% by weight of lead are hitherto used in so-called high t...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L23/488H01L23/373H01L21/50H01L21/60H05K1/18H05K3/30H05K3/32H01B1/22B23K35/22C09J163/00C09J11/04
CPCH01L2924/01015H01L2924/0105H01L2924/01082H01L2924/0781H01L24/29H01L2924/15747H01L2224/29347H01L2924/01019H01L2924/01029H01L2224/83801H01L2224/29111H01L2924/0132H01L2224/29H01L2924/014H01L2924/01013H01L2224/29101C09J163/00H01L2224/29298H01L2924/0665H01L2224/2919H01L2224/2929H01L2924/01047H01L2924/0133H01L24/83H01L2924/01033H01L2924/01006H01L2924/01074H01L2924/10253H01L24/75C08L2666/54H01L2924/00012H01L2924/00015H01L2924/00014H01L2924/00
Inventor 米里埃尔·托马斯克劳斯·沙克蒂莫·格尔根
Owner UMICORE AG & CO KG