Leadless integrated circuit protection device

A technology for circuit protection and protection components, which is applied in the field of leadless integrated circuit protection components to achieve the effects of good performance characteristics, low impedance and low conductance

Inactive Publication Date: 2007-10-31
LITTELFUSE INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] Integrating overcurrent and overvoltage protection into a single component presents specific challenges

Method used

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  • Leadless integrated circuit protection device
  • Leadless integrated circuit protection device
  • Leadless integrated circuit protection device

Examples

Experimental program
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Embodiment Construction

[0052] Detailed herein are embodiments of leadless circuit protection components that meet the current goals of the semiconductor industry to use components that are smaller and can be produced at a faster rate. Embodiments disclosed herein are compliant with semiconductor industry standards such as those set forth in JEDEC 95 Edition, Design Guide 4.19, Interleaved Quad No-Leads, and In-Line Multi-Nine Packages (“QFN”).

[0053] The components in the embodiments are lead frame based and encapsulated in a low impedance, conductance, capacitance ("RLC") package plastic. Lead frame construction designs the type, characteristics and configuration of the circuit protection components packaged in the component for the specific application. components have good heat dissipation capabilities. The integration of overcurrent and overvoltage functions helps ensure proper coordination, and close proximity of circuit protection components packaged throughout the unit enhances electrical ...

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Abstract

A circuit protection device includes a fuse placed in electrical communication with first and second conductors. An overvoltage protection component is placed in electrical communication with the first conductor and a third conductor. An insulative housing encloses the fuse, overvoltage protection component and portions of the first, second and third conductors. The first and second conductors include first and second terminal portions, respectively, that extend through the housing and reside at least substantially flush with an outer surface of the housing.

Description

technical field [0001] The present invention generally relates to circuit protection components, and in particular to leadless integrated circuit protection components. Background technique [0002] Certain electrical and electronic circuits require overcurrent and overvoltage protection. In the past, overcurrent and overvoltage protection has been achieved by at least two discrete components. Each element provides protection for a specific application. For example, discrete overcurrent elements are used to provide protection in the event of overcurrent. In addition, a discrete voltage suppressor is used to provide protection in case of excessive voltage. The two discrete components are interconnected by printed circuit board traces. Valuable space on the printed circuit board is consumed by the individual pin packaging of each component. Board designers are constantly looking for ways to save board space. Reducing the overall board space required for overcurrent and o...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L23/00H01L23/58H01L23/62H01L25/00H02H3/08H02H3/20H02H9/04
CPCH01H2085/0414H01H85/44H01H2085/0034H01L2924/0002H01C7/12
Inventor 理查德·詹姆斯·博诺胡安·德迪奥斯·马丁内斯史蒂文·J.·惠特尼
Owner LITTELFUSE INC
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