Low-toxicity urea-formaldehyde resin for EO grade adhesive-bonded panel and preparation method and application thereof
A urea-formaldehyde resin, plywood technology, applied in the direction of adhesives, adhesive types, aldehyde/ketone condensation polymer adhesives, etc., can solve the problem of decreased bonding strength, poor storage stability of low-molar ratio urea-formaldehyde resins, and pre-compression of urea-formaldehyde resin adhesives Long time and other problems, to achieve the effect of low cost, low free formaldehyde content and low cost
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specific Embodiment approach 1
[0009] Specific embodiment one: the low-toxic urea-formaldehyde resin (abbreviated as UF) for the E0 grade plywood of the present invention is made of formaldehyde (37% industrial grade can be selected), urea (98% purity can be selected), polyvinyl alcohol, reinforcing agent, The basic catalyst and the acid catalyst are prepared according to the following ratio: formaldehyde: 100 parts by weight, polyvinyl alcohol: 1-1.5 parts by weight, reinforcing agent: 3.75-6 parts by weight, basic catalyst: 2000-2500ml, acid catalyst: 600-800ml, the molar ratio of formaldehyde to urea and the enhancer is 0.97-0.98:1; the enhancer is melamine, the basic catalyst is sodium hydroxide with a concentration of 30% by mass, and the acidic catalyst is 30% by mass 40% formic acid.
specific Embodiment approach 2
[0010] Embodiment 2: In this embodiment, the ratio of the sum of the moles of formaldehyde, urea and enhancer is 0.972-0.978:1. Others are the same as in the first embodiment.
specific Embodiment approach 3
[0011] Specific embodiment three: In this embodiment, the ratio of the sum of the moles of formaldehyde, urea and enhancer is 0.975:1. Others are the same as in the first embodiment.
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