Apparatus for positioning microcomponent to the substrate and method therefor
A positioning device and micro-component technology, applied in the direction of electrical components, electrical components, electric solid devices, etc., can solve problems such as difficult to use crystal grains, damage to crystal grains, and difficulty in increasing output per unit time
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[0077] Please refer to Fig. 5(A)-5(G), Fig. 5(A)-5(G) shows a kind of developed, the method for positioning microcomponent on the substrate of new style, it comprises the following steps: Provide a Substrate 50; form a convex structure 51 on the substrate 50; form a micro drop 52 on the convex structure 51; provide a micro component 53; and make the micro component 53 contact the micro drop 52, to utilize the micro drop 52 surface tension to move the micro-component 53 onto the surface 54 of the convex structure 51 as shown in FIG. 5(B).
[0078] Referring to FIGS. 6(A)-6(C), the method for manufacturing the convex structure 51 also includes forming a surrounding groove 61 on the substrate 60 by etching, or using a die of a pressing mechanism or a die of gravity punching, Surrounding the groove 61 is the periphery 61 of the convex structure 62, so as to form the convex structure 62 higher than the periphery 61 of the convex structure. The pattern is transcribed on the photore...
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