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Apparatus for positioning microcomponent to the substrate and method therefor

A positioning device and micro-component technology, applied in the direction of electrical components, electrical components, electric solid devices, etc., can solve problems such as difficult to use crystal grains, damage to crystal grains, and difficulty in increasing output per unit time

Inactive Publication Date: 2007-12-05
IND TECH RES INST
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0008] 2. Due to the need for mechanical control, it takes a long time to locate the tiny grains in the correct position;
[0009] 3. Since the mechanical arm is used as a way to adjust the position, its adjustment accuracy is limited. For higher precision positioning requirements, a more complex mechanical structure and electronic control system need to be designed. The smaller the grain, the higher the unit cost;
[0010] 4. Since the robot arm is used as a way to adjust the position, only one piece can be placed at a time, so it is difficult to increase the output per unit time; and
[0011] 5. Since the mechanical arm is used as a way to adjust the position, it is becoming more and more difficult to pick up grains with a vacuum pen, and it is difficult to use for grains smaller than millimeters
[0016] 4. The method of fluid self-assembly technology to place tiny crystal grains on the substrate is to place a large number of tiny crystal grains in the aqueous solution and recover the unplaced crystal grains. Since the crystal grains have to be placed in the aqueous solution for a long time, the creates a risk of die damage; and
[0017] 5. The method of fluid self-assembly technology to place tiny grains on the substrate needs to prepare a much higher number of tiny grains than the original target packaging, thereby increasing the probability of the grains 40 falling into the groove 42, so as to maintain the yield of the package. The output rate and the good rate, but also to avoid some unfilled grooves and some failures to fill in the correct position. Therefore, such defective positioning devices are really not ideal.

Method used

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  • Apparatus for positioning microcomponent to the substrate and method therefor
  • Apparatus for positioning microcomponent to the substrate and method therefor
  • Apparatus for positioning microcomponent to the substrate and method therefor

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Embodiment Construction

[0077] Please refer to Fig. 5(A)-5(G), Fig. 5(A)-5(G) shows a kind of developed, the method for positioning microcomponent on the substrate of new style, it comprises the following steps: Provide a Substrate 50; form a convex structure 51 on the substrate 50; form a micro drop 52 on the convex structure 51; provide a micro component 53; and make the micro component 53 contact the micro drop 52, to utilize the micro drop 52 surface tension to move the micro-component 53 onto the surface 54 of the convex structure 51 as shown in FIG. 5(B).

[0078] Referring to FIGS. 6(A)-6(C), the method for manufacturing the convex structure 51 also includes forming a surrounding groove 61 on the substrate 60 by etching, or using a die of a pressing mechanism or a die of gravity punching, Surrounding the groove 61 is the periphery 61 of the convex structure 62, so as to form the convex structure 62 higher than the periphery 61 of the convex structure. The pattern is transcribed on the photore...

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PUM

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Abstract

The invention relates to a device and method for locating micro elements on a substrate, comprising the steps of: providing a substrate and forming a salient structure on the substrate; providing a micro component and forming a micro liquid bead on the salient structure; and using surface tension of the micro liquid bead to move the micro component onto a surface of the salient structure. Thus, it can effectively improve the problems that micro crystal grain location by mechanical arm is tool slow and FSA still needs a crystal grain recovery system designed.

Description

technical field [0001] The invention relates to a device and method for positioning micro components on a substrate, in particular to a device and method for positioning micro components on a substrate by using a convex structure. Background technique [0002] Currently common radio frequency identification tags (Radio Frequency Identification Tag, or RFID Tag) and Light Emitter diodes (Light Emitter diode, or LED) are two representative products that use tiny grains. The size is very small, and the price is low and the dosage is high. In the cost structure of the entire product, the traditional packaging cost occupies a high proportion (about 20%). Therefore, how to reduce the packaging cost and mass production becomes a One of the most important research topics. Please refer to FIG. 1. FIG. 1 shows an RFID Tag 10 produced by RVB System group (RVB System Group), which has a tiny crystal grain 11 and a group of arc-shaped antennas 12 that gradually expand from inside to out...

Claims

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Application Information

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IPC IPC(8): H01L21/68H05K13/04
CPCH01L24/95H01L2224/95085
Inventor 叶哲良蔡智伟谢志鸿翁文杰黄一萍高崎钧周明宏
Owner IND TECH RES INST