Low viscosity curable compositions

A composition, low viscosity technology for electro-solid devices, other chemical processes, chemical instruments and methods, etc., which can solve problems such as reducing the efficacy of the composition

Inactive Publication Date: 2007-12-12
NAT STARCH & CHEM INVESTMENT HLDG CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Another common pitfall is that contaminants in the soldered interconnection neutralize the catalyst and thus reduce the effectiveness of the composition

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment

[0022] A 40 gram quantity of cycloaliphatic epoxy resin was added to a small mixing container. With continued stirring, a 1.4 gram amount of hexafluoroantimonate superacid was added to the vessel. The mixture was stirred for several hours until the catalyst dissolved. 23 grams of polyester polyol and 23 grams of divinyl ether were added to the mixture. An amount of 14 grams of SOE2 silica was added and the mixture was stirred until the silica was completely dispersed. The mixture is then continued to stir until it reaches a homogeneous state. At this time, in order to improve the process, 0.2 g of degassing agent was added. The mixture was tested for flow time, viscosity and settling. The test results are shown in Table 1.

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PUM

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Abstract

A low viscosity capillary flow underfill composition having improved filler dispersion and cure rate. One embodiment of the composition comprises one or more epoxy resins, such as cycloaliphatic epoxy resins, one or more catalysts, such as super acid catalysts and one or more inert components, which may comprise diluents such as non-electrically conductive fillers. Further embodiments of the invention include compositions further comprising low viscosity non-epoxy reactive diluents, such as vinyl ether, and polyols such as polyester polyols. A further embodiment is a method of assembling an electronic component utilizing the low viscosity underfill composition of the present invention. A still further embodiment is an electronic device or component containing the underfill composition of the present invention.

Description

technical field [0001] [01] The present invention relates to low viscosity underfill encapsulants and methods of applying them to electronic components. Background technique [0002] [02] The present invention relates to underfill encapsulant compounds prepared from epoxy resins to protect and reinforce interconnects between electronic components and substrates on microelectronic devices. Microelectronic devices contain many types of circuit elements, primarily transistors assembled together on an integrated circuit (IC) chip, but also resistors, capacitors and other components. These electronic components are interconnected to form a circuit, and finally connected to and carried on a carrier or substrate, such as a printed circuit board. The integrated circuit element may comprise a single bare chip, a single packaged chip, or a hermetically sealed package of multiple chips. A single die can be attached to a lead frame, which in turn is packaged and attached to a printed ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L63/00C08K7/20C09K3/12H01L23/29C08K3/00
CPCC08G59/42C08G59/68C08G59/24C09D163/00
Inventor B·C·惠洛克P·莫尔加勒里
Owner NAT STARCH & CHEM INVESTMENT HLDG CORP
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