129results about How to "Improve cure rate" patented technology

The invention belongs to the field of a high molecular material, and particularly relates to photo-cured elastic photosensitive resin with wavelength being 405 nanometers for 3D printing of digital light processing (DLP). The elastic photosensitive resin comprises the following raw materials based on parts by weight: 10-50 parts of elastic acrylate, 30-70 parts of active diluents, 1-10 parts of photoinitiator, 0.01-0.05 part of flatting agent, 0.01-0.05 part of dispersning agent and 0.01-0.05 part of polymerization inhibitor. The elastic photosensitive resin can be directly used for 3D printing of DLP or can be mixed with other existing photosensitive resin, a product with a complicated structure and certain elasticity can be printed, meanwhile, the elastic photosensitive resin has the characteristics of small volatile odor, rapid formation speed, small product shrinkage rate, high formation accuracy and the like.

The invention discloses an anti-static optical adhesive which is prepared from the following raw materials in percentage by weight: 1-5% of an antistatic agent, 30-60% of polyurethane acrylate, 20-50% of an acrylate monomer, 5-10% of unsaturated polyester, 0-2% of a photoinitiator (excluding 0%), 3-6% of a crosslinking agent and 1-5% of a coupling agent. The preparation method comprises the following steps: (1) adding polyurethane acrylate, part of the acrylate monomer and unsaturated polyester into a reaction kettle, stirring and heating in a water bath to a stable backflow state; (2) uniformly mixing residual raw materials, putting into the reaction kettle and stirring for polymerization reaction; and (3) finishing the polymerization reaction to obtain the anti-static optical adhesive. The anti-static optical adhesive disclosed by the invention is a colorless transparent viscous liquid matter, has the characteristics of being anti-static, high in light transmittance, high in curing speed, low in cure shrinkage rate and low in haze and the like and can be widely applied to fitting an optical protective thin film base material and a release film.

The invention discloses a 3D printing device and method for high-molecular-weight silicone rubber. A hundred-micron-level micropore nozzle with the high shearing rate and high extruding strength and for screw extruding force is adopted in a 3D printing head system, the flowing viscosity of the high-molecular-weight silicone rubber is greatly reduced, and 3D printing forming of a high-molecular-weight, high-compression-modulus and long-service life silicone rubber material is achieved. The extrusion and expansion stability of the material on the hundred-micron-level micropore nozzle is improved, the dimensional precision of a 3D printing fluid line is accurately controlled, and high quality, high precision and high efficiency in the 3D printing process are achieved. A photo-thermal two-order curing material 3D printing manner is adopted, the curing rate and dimensional precision of the 3D printing material are greatly increased, the high quality and stability of the 3D printing high-molecular-weight silicone rubber material are improved, and the macro-performance and structure adjustability of the 3D printing material are achieved.

The invention discloses a polyurethane sealant and a preparation method thereof. The sealant is prepared from a prepolymer, a plasticizer, pigment and filler, a thickening agent, and a silane coupling agent, wherein the prepolymer is composed of polyether diol, polyether triol, butanediol, diphenylmethane diisocyanate, dibutyltin dilaurate, an oxazolidine latent curing agent, an acid catalyst and a defoaming agent. After the sealant is cured, the tensile strength of an elastomer is more than or equal to 8MPa, and the elongation at break is more than or equal to 450%. The sealant not only has good curing rate at normal temperature, but also has high curing rate in low temperature and low humidity conditions. The polyurethane sealant is suitable for elastic bonding of high mechanical property, for example, elastic bonding for glass installation of automobiles, trains, ships, planes, cable cars and the like. The polyurethane sealant is suitable for rapid bonding in low temperature and low humidity environments and other elastic bonding of high mechanical property.

The invention discloses an antibacterial and anti-fingerprint paint for mobile phones. The paint comprise the following raw materials by weight: 20-38 parts of a urethane acrylate oligomer, 10-30 parts of epoxy acrylic resin, 2.5-5.5 parts of an antibacterial agent, 15-28 parts of trimethylolpropane triacrylate, 5-9 parts of N-vinyl pyrrolidone, 13-30 parts of 1, 6-hexanediol diacrylate, 3-4.8 parts of a photoinitiator, 8-14 parts of nano-filler, and 0.5-1.3 pars of an assistant. The antibacterial and anti-fingerprint paint for mobile phones provided by the invention has good antibacterial properties and scratch resistance, and excellent antifouling and anti-fingerprint properties.

The invention relates to an antibacterial low-melting-point hot melt adhesive. The antibacterial low-melting-point hot melt adhesive is processed from the following raw materials in parts by weight: 40-80 parts of a polyester hot melt adhesive, 20-30 parts of polyamide resin, 3-8 parts of paraffin, 0.5-1 part of an antioxidant 164 and 0.5-1 part of an inorganic antibacterial agent. A preparation method of the antibacterial low-melting-point hot melt adhesive comprises the following steps: uniformly mixing the polyester hot melt adhesive, the polyamide resin, the paraffin, the antioxidant and the inorganic antibacterial agent according to the formula ratio, adding the mixture into a screw extruder granulator, carrying out melt blending extrusion, cooling and granulating the extruded mixture, and carrying out vacuum drying on the aggregates to remove moisture, so as to obtain the antibacterial low-melting-point hot melt adhesive. By mixing the low-melting-point polyester hot melt adhesive with the polyamide resin, the paraffin, the antioxidant and the inorganic antibacterial agent, the prepared hot melt adhesive is stable in binding power, high in curing speed and convenient to use and does not easily mildew, the environmental influence is low, and particularly, the curing rate is prior to that of the hot melt adhesive in the prior art in a low-temperature environment; the production efficiency is greatly improved, the cooling curing time is substantially shortened after the coating of the hot melt adhesive, and the coating efficiency is remarkably improved.

The invention discloses anti-cracking, wear-resistant and seepage-proof compound mortar. The anti-cracking, wear-resistant and seepage-proof compound mortar is prepared from raw materials in parts by weight as follows: 20-30 parts of long and short reinforcing fiber, 15-20 parts of a waterproof additive, 10-20 parts of gelatine powder, 10-16 parts of a composite aid, 10-14 parts of glass beads, 65-75 parts of Portland cement, 55-65 parts of fine sand, 35-45 parts of composite filling sand, 1-2 parts of triethanolamine and 1-3 parts of sodium tripolyphosphate. The compound mortar has excellent anti-cracking, wear-resistant and efflorescence preventing properties and has better water resistance, seepage-proof property and adhesion force, relatively excellent impact resistance and thermal insulation and sound insulation effects and a certain pollutant air absorption function; besides, according to the provided preparation method, the material cost is lower, raw materials are easy to obtain, the process is simple, and the compound mortar has higher practical value and excellent application prospects.

The invention discloses a one-component polyurethane foam caulking agent, which comprises the following components in parts by weight: 30.0-60.0 parts of polyether polyol, 2.0-6.0 parts of catalysts,1.0-4.0 parts of curing agents, 2.0-6.0 parts of plasticizers and 20.0-40.0 parts of solvents. The one-component polyurethane foam caulking agent has good flexibility and tensile strength, uniform foam holes, and can be used in a low-temperature environment; a DMDEE catalyst is contained inside the agent, and has soft activity and good storage stability, and thus the surface drying rate, curing rate and foaming rate of OCF can be effectively promoted; a CP52 plasticizer is contained inside the agent, and has good compatibility, and thus the viscosity and brittleness of the OCF is reduced, andthe flexibility is increased; and a ketoimine curing agent is added inside the agent, and thus the viscosity of the OCF can be reduced, the agent can be quickly wet cured, and the tensile strength isimproved.

The invention discloses a polyurethane acrylate prepolymer and a preparation method thereof, as well as paint prepared by the polyurethane acrylate prepolymer. The prepolymer comprises the following components in part by mass: 900-1100 parts of hexamethylene diisocyanate, 2-5 parts of dibutyl tin laurate, 400-600 parts of polyethylene glycol, 1-3 parts of hydroquinone and 1000-1300 parts of hydroxyethyl acrylate. According to the invention, the paint prepared by the polyurethane acrylate prepolymer is high in curing rate, can effectively improve gloss, flexibility and adhesion level of floorboards, and is excellent in use effect.

The invention relates to the technical field of biology and provides a substrate for a biological chip. The substrate is formed by jointing a polyamide-amine dendritic macromolecule on a solid support through a covalent bond; the polyamide-amine dendritic macromolecule is a dendritic macromolecule which radiates 64 amino terminals with ethidene diamine as a center, and a molecular weight is 14,214 to 14,220; and the polyamide-amine dendritic macromolecule is activated by an aldehyde group. The substrate for the biological chip adds reaction points through the multiple amino terminals of the dendritic macromolecule, so that the sensitivity of the biological chip is enhanced. The invention also provides a gene chip prepared from the substrate, a method for preparing the gene chip and a method for detecting a target by using the gene chip.

The invention discloses a high-toughness and high-flame-retardant polyurethane circuit board material which comprises polyester polyol, 2, 6-diisopropyl benzene isocyanate, dimethyl-biphenyl diisocyanate, terephthalyl alcohol, 1, 4-butanediol, 4, 4'-diamino-3, 3'-dichlorodiphenylmethane, dibutyltin dilaurate, catalyst DMP (dimethyl phthalate)-30, bicyclopentadiene dioxide epoxy resin, polyvinyl chloride, maleic anhydride, nano-calcium carbonate, alpha, omega-dihydroxy polydimethylsiloxane, 1-oxygen-4-hydroxymethyl-2, 6, 7-trioxa-1-phospha-dicyclo[2.2.2] octane and phosphorus-containing flame retardants. The high-toughness and high-flame-retardant polyurethane circuit board material has excellent flame resistance and toughness and is good in heat resistance and long in service life.

The invention provides a temperature response type polymeric biomedical adhesive and a preparation method thereof and belongs to the technical field of adhesive application materials. According to the invention, by taking a polyhydroxy or poly-amino hyperbranched polymer as an initiator, tetrahydrofuran as a solvent, and amino acids with N-carbonyl anhydride at the tail end as functional monomers, under the protection of nitrogen, polymerization reaction is performed for 48-72 hours at room temperature, and after reaction is ended, a crude product is precipitated by using a mixed solution of triethylamine-ethyl alcohol, so as to obtain the polymeric biomedical adhesive which has the bonding strength of 90-130Kpa at 37+/-0.5 DEG C. In addition, by taking amino acids which are needed for the human body as raw materials, the polymeric biomedical adhesive has good biocompatibility and no side effects, and can be degraded and metabolized in tissues.

A polyurethane oligomer taking vinyl ether as an end group and a synthesis method are disclosed, wherein the structural formula (I) of the compound is FORMULA; and the synthesis method comprises the following process steps of: dripping polyol in diisocyanate and mechanmically stirring; controlling a temperature to be 0-90 DEG C and reacting for 1-6 hours; adding a catalyst and heating to 60-120 DEG C after the reaction is finished; dripping the mixed solution of hydroxyalkyl vinyl ether diluted by a solvent; and continuing to react with stirring for 2-7 hours after the dripping is finished. The synthesis method has the advantages of being simple in process, high in production rate, low in cost, and reduced in environmental pollution. The product prepared by the method can be used as a coating without being purified, as well as is great in dissolubility, simple in synthesis process, easy in control for conditions, and excellent in practical application value.

The invention provides a weather-resistant fadeproof organic paint for colored steel plates, which is characterized by comprising the following raw materials in parts by weight: 20-35 parts of polyacrylic resin, 20-30 parts of polyvinylidene fluoride resin, 3-5 parts of polymethyl siloxane, 5-8 parts of titanium white, 5-8 parts of aluminum powder, 2-3 parts of graphite powder, 2-3 parts of leveling agent, 4-6 parts of Ti2AlC/TiAl composite material, 0.5-2 parts of organobentonite, 0.5-1 part of stabilizer, 0.2-1 part of dispersing agent, 0.5-1 part of defoaming agent and 30-40 parts of solvent. The paint has the advantages of high coating adhesion firmness, high flexibility, high binding force, high impact resistance, high acid/alkali resistance, high aging resistance, high glossiness, high curing rate, high water resistance, high durability, high compatibility, favorable weather resistance, small influence of film thickness difference on color difference, and the like, and thus, is a weather-resistant fadeproof organic paint for colored steel plates with excellent comprehensive properties.

The invention relates to the technical field of anti-corrosion coatings, and particularly relates to a long-acting anti-corrosion solvent-free universal epoxy coating and a preparation method thereof.The long-acting anti-corrosion solvent-free universal epoxy coating comprises a first component and a second component, wherein the first component comprises epoxy resin, adipic acid modified epoxy resin and graphene dispersion liquid; and the second component comprises an amine mixed curing agent and an amino silane coupling agent. The coating provided by the invention effectively solves the problems of large internal stress, poor coating flexibility and corrosion resistance, easiness in oil surface and gloss loss in a low-temperature environment and a high-humidity environment and the likeof an existing solvent-free epoxy coating system, has excellent corrosion resistance, good recoatability, excellent matching performance with various finishing paints, good weather resistance and thelike, has good film-forming property in low-temperature and high-humidity environments, has no oil surface or gloss loss, and achieves the technical goals of universality of the whole ship and universality in four seasons.

The invention relates to a preparation method for a fixed abrasive polishing pad, and belongs to the technical field of chemical-mechanical polishing dressing preparation. Zirconium propoxide solution serves as a precursor, composite epoxy resin and acetone serve as mediums, and after high-refractive fiber is prepared by electrostatic spinning, the high-refractive fiber and Sic abrasive grit are mixed and ball-milled and blend with other materials; and in the process of ultraviolet light polymerization, ultraviolet light penetrates into a deep layer of the fixed abrasive polishing pad to conduct ultraviolet curing under the influence of high-refractive materials, the curing rate and the homogeneous curing degree of the fixed abrasive polishing pad are effectively improved, and the using performance of the polishing pad is effectively improved. According to the preparation method for the fixed abrasive polishing pad, the hardness of a pencil in a dry state is 3-4 H, the hardness of a pencil in a hygrometric state is 3 H/3-5 B, the swelling ratio is 2.67-3.56%, and a long service life and a high working efficiency are achieved.

The invention discloses an epoxy resin adhesive for electronic devices, and belongs to the technical field of adhesives. The epoxy resin adhesive comprises a component A and a component B, wherein thecomponent A is 25-35 parts of a composite ionic liquid curing agent; the component B is prepared from 65 to 75 parts of epoxy resin, 0 to 2 parts of an accelerant, 0 to 2 parts of a diluent, 0 to 2 parts of a plasticizer and 0 to 1 part of a filler. The epoxy resin adhesive prepared by the method is long in working life and high in reaction activity, can be quickly cured within 3 minutes at roomtemperature, remarkably shortens the forming period, and completely meets the requirement of a quick manufacturing technology in the field of electronic device bonding on the production efficiency.

The invention provides a latent curing type single-component polyurethane adhesive, the adhesive is prepared from the following components in parts by weight: 80-120 parts of polyether polyol, 20-40 parts of isocyanate, 3-10 parts of a chain extender and 0.5-2 parts of a latent curing agent, a preparation method of the adhesive comprises the following steps: preparing a polyurethane prepolymer, cooling the polyurethane prepolymer to 40-60 DEG C, slowly dropwise adding the chain extender into a four-neck flask containing the polyurethane prepolymer so as to obtain a reaction product, slowly dropwise adding the latent curing agent while stirring to the reaction product, and uniformly stirring to obtain the latent curing type single-component polyurethane adhesive.

The invention relates to a preparation method of a photo-curable graphene solvent-free epoxy fiberglass reinforced plastic paint, in particular to a photo-curable graphene solvent-free epoxy fiberglass reinforced plastic paint and a preparation method thereof. The photo-curable graphene solvent-free epoxy fiberglass reinforced plastic paint is made from, by percent, resin, a monomer (an active diluent), glass powder, a photoinitiator A, a photoinitiator B, a defoaming agent, an adhesion promoter, and graphene oxide. During curing, the graphene oxide is reduced into graphene, so that improved adhesion, wear resistance and the like are imparted to a coating; the photo-curable graphene solvent-free epoxy fiberglass reinforced plastic paint also has the advantages of high curing speed, excellent corrosion resistance, good mechanical properties, good construction operability and the like. The photo-curable graphene solvent-free epoxy fiberglass reinforced plastic paint is applicable to pipeline joint patch, station buried pipelines, pipeline crossing external protection, pipeline elbows of different diameters and the like.

The invention discloses low-energy UV-curable circuit ink and a preparation method thereof and belongs to the technical field of light-curable circuit inks. The low-energy UV-curable circuit ink is mainly made from, by weight, 22-28 parts of epoxy acrylate resin, 3-8 parts of 2-methyl-1-[4-(methylthio)phenyl]-2-(4-morpholinyl)-1-acetone, 1-3 parts of diphenyl(2,4,6-trimethylbenzoyl)phosphine oxide, 32-38 parts of talcum powder, 3-4 parts of silicon dioxide, 0.5-1.5 parts of phthalo blue powder, 12-18 parts of hydroxyethyl methylacrylate, 7-12 parts of trimethylolpropane triacrylate, 2-6 partsof phosphates, 0.15-0.4 part of a defoaming agent, 0.2-0.5 part of a dispersing agent, and 8-12 parts of barium sulfate. The invention is intended to provide low-energy UV-curable circuit ink having scientific formulation and low energy and a preparation method thereof; the low-energy UV-curable circuit ink is applicable to circuit board production.

The invention discloses expansion monomer modified light-cured resin and a preparation method thereof, and aims to provide the expansion monomer modified light-cured resin and the preparation method thereof. The light-cured resin plays a very critical role in a light-cured rapid prototyping technology (SLA), the prototyping technology has the characteristics of low energy consumption, low cost, high prototyping precision and the like, and promotes the huge change of the manufacturing field. In the prior art, light-cured resin has the problem of volume shrinkage in the curing process, so that aformed product is large in shrinkage warping, low in precision and poor in mechanical property, and the performance of a final finished product is influenced. According to the invention, an expansionmonomer is introduced into a resin curing system; therefore, the volume shrinkage of the photo-cured resin during polymerization is counteracted by utilizing the polymerization expansion characteristic of the photo-cured resin, so that the prepared photo-cured composite resin has low shrinkage characteristic, good physical and chemical properties and thermodynamic properties, can be molded by adopting direct photo-curing rapid molding, 3D printing molding and the like, and has a wide application prospect.

The invention relates to a phenolic plastic, discloses a modified phenolic molding compound with high bending strength and a preparation method of the modified phenolic molding compound, and solves the problems that properties such as tensile strength and flexural modulus of a phenolic molding compound are reduced when brittleness of the phenolic molding compound is reduced in the prior art. The modified phenolic molding compound with the high bending strength comprises the following raw materials, in parts by mass: 200 parts of thermosetting phenolic resin, 4-6 parts of 2-formyl-3,4-dihydropyran, 3-5 parts of polyvinyl alcohol, 0.2-4 parts of a demolding auxiliary agent, 7-12 parts of a filler, and 2-3.5 parts of a pigment, wherein the thermosetting phenolic resin is liquid thermosettingphenolic resin; and the method comprises the steps of firstly mixing the 2-formyl-3,4-dihydropyran and the thermosetting phenolic resin for a reaction, then adding the polyvinyl alcohol, performing areaction under mixing, adding the demolding auxiliary agent, the filler and the pigment, performing mixing, and performing plastication to obtain the modified phenolic molding compound. According to the method provided by the invention, the rigidity and toughness performance are improved while the brittleness of the modified phenolic molding compound is reduced.