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Low-energy UV-curable circuit ink and preparation method thereof

A light-curing, low-energy technology, applied in inks, household utensils, applications, etc., can solve the problems of limiting the popularization and application of UV light curing, slow curing speed, low production efficiency, etc., to improve the curing speed, increase the curing speed, The effect of improving productivity

Inactive Publication Date: 2018-08-17
丰顺县三和电子材料有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, direct application of UV light source to traditional light-curable line inks for light-curing still has defects such as slow curing speed, high energy consumption, and low production efficiency, which limits the popularization and application of UV light-curing in light-curable line inks.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0035] Epoxy acrylate resin formula (mass percentage): novolak epoxy resin 30%, acid anhydride 40%, acrylic acid 24%, catalyst 3% and polymerization inhibitor 3%.

[0036] Photocurable line ink formula: 22 parts of epoxy acrylate resin, 3 parts of 2-methyl-1-[4-(methylthio)phenyl]-2-(4-morpholino)-1-acetone, 1 part of 2,4,6-trimethylbenzoyl-diphenylphosphine oxide, 32 parts of talc powder, 3 parts of silicon dioxide, 0.5 parts of titanium blue powder, 12 parts of hydroxyethyl methacrylate, trihydroxy 7 parts of methylpropane triacrylate, 2 parts of phosphate ester, 8 parts of barium sulfate, 0.15 part of polyether silicone oil and 0.2 part of BYK-104S.

[0037] Preparation method of photocurable circuit ink: (1) Preparation of epoxy acrylate resin

[0038](a) take by weighing each component that prepares epoxy acrylate resin by formula quantity, for subsequent use;

[0039] (b) under the environment of 60° C. to 90° C., add an acid anhydride accounting for 25% of the total m...

Embodiment 2

[0045] Epoxy acrylate resin formula (mass percentage): novolak epoxy resin 65%, acid anhydride 10%, acrylic acid 24.64%, catalyst 0.3% and polymerization inhibitor 0.06%.

[0046] Photocurable line ink formula: 28 parts of epoxy acrylate resin, 8 parts of 2-methyl-1-[4-(methylthio)phenyl]-2-(4-morpholinyl)-1-acetone, 3 parts of 2,4,6-trimethylbenzoyl-diphenylphosphine oxide, 38 parts of talc powder, 4 parts of silicon dioxide, 1.5 parts of titanium blue powder, 18 parts of hydroxyethyl methacrylate, trihydroxy 12 parts of methylpropane triacrylate, 6 parts of phosphate ester, 12 parts of barium sulfate, 0.4 part of polyether silicone oil and 0.5 part of S5200.

[0047] Preparation method of photocurable circuit ink: (1) Preparation of epoxy acrylate resin

[0048] (a) take by weighing each component that prepares epoxy acrylate resin by formula quantity, for subsequent use;

[0049] (b) under the environment of 60° C. to 90° C., add an acid anhydride accounting for 5% of the...

Embodiment 3

[0055] Epoxy acrylate resin formula (mass percentage): novolak epoxy resin 38%, acid anhydride 15%, acrylic acid 45%, catalyst 1% and polymerization inhibitor 1%.

[0056] Photocurable line ink formula: 25 parts of epoxy acrylate resin, 5 parts of 2-methyl-1-[4-(methylthio)phenyl]-2-(4-morpholino)-1-acetone, 2,4,6-trimethylbenzoyl-diphenylphosphine oxide 2 parts, talc powder 35 parts, silicon dioxide 3 parts, titanium blue powder 1 part, hydroxyethyl methacrylate 15 parts, trihydroxy 10 parts of methyl propane triacrylate, 4 parts of phosphate ester, 10 parts of barium sulfate, 0.2 part of polyether silicone oil and 0.35 part of BYK-104S.

[0057] Preparation method of photocurable line ink:

[0058] (1) Preparation of epoxy acrylate resin

[0059] (a) take by weighing each component that prepares epoxy acrylate resin by formula quantity, for subsequent use;

[0060] (b) Add acid anhydride accounting for 10% of the total mass of the reaction system to the novolac epoxy resi...

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PUM

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Abstract

The invention discloses low-energy UV-curable circuit ink and a preparation method thereof and belongs to the technical field of light-curable circuit inks. The low-energy UV-curable circuit ink is mainly made from, by weight, 22-28 parts of epoxy acrylate resin, 3-8 parts of 2-methyl-1-[4-(methylthio)phenyl]-2-(4-morpholinyl)-1-acetone, 1-3 parts of diphenyl(2,4,6-trimethylbenzoyl)phosphine oxide, 32-38 parts of talcum powder, 3-4 parts of silicon dioxide, 0.5-1.5 parts of phthalo blue powder, 12-18 parts of hydroxyethyl methylacrylate, 7-12 parts of trimethylolpropane triacrylate, 2-6 partsof phosphates, 0.15-0.4 part of a defoaming agent, 0.2-0.5 part of a dispersing agent, and 8-12 parts of barium sulfate. The invention is intended to provide low-energy UV-curable circuit ink having scientific formulation and low energy and a preparation method thereof; the low-energy UV-curable circuit ink is applicable to circuit board production.

Description

technical field [0001] The invention relates to a photocurable line ink, more specifically, to a low-energy UV photocurable line ink. The invention also relates to a method for preparing the photocurable line ink. Background technique [0002] At present, photocurable circuit inks for printed circuit boards are showing rapid growth. Traditional photocurable circuit inks can be quickly cured under the action of ultraviolet (UV) light, thereby forming a photocurable circuit protective layer on the surface of the printed circuit board. UV curing technology is known as "5E" technology, which has the advantages of environmental protection, energy saving, short drying time, good gloss, and wide application range. [0003] LED-UV light source is a low-energy curing light source that emits single-wavelength ultraviolet light at 365nm, 375nm, 385nm, 395nm, and 405nm. Compared with traditional UV high-pressure mercury lamps, the advantages of UV light sources are: long service life...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09D11/101
CPCC09D11/101
Inventor 黄春锐彭燕娟程祥桂
Owner 丰顺县三和电子材料有限公司
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