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Epoxy resin adhesive for electronic devices and preparation method thereof

A technology for epoxy resin glue and electronic devices, which is applied in the direction of epoxy resin glue, novolac epoxy resin adhesive, adhesive, etc. Problems such as low degree of cross-linking

Active Publication Date: 2020-10-23
郯城博化化工科技有限公司 +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] In order to solve the technical problems of long curing time, harsh curing conditions, short gel time and low degree of crosslinking of the polymerization network in the prior art, the present invention provides an epoxy resin with simple synthesis process, fast curing speed and no curing after curing. Transparent epoxy resin glue and preparation method thereof

Method used

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  • Epoxy resin adhesive for electronic devices and preparation method thereof
  • Epoxy resin adhesive for electronic devices and preparation method thereof
  • Epoxy resin adhesive for electronic devices and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0028] An epoxy resin glue for electronic devices, the epoxy resin glue includes A component and B component, wherein A component is 25 parts of composite ionic liquid curing agent; B component is: 65 parts of epoxy resin;

[0029] The preparation method of the composite ionic liquid curing agent is: weigh 2,3-(dimercaptoethyl)-1-propanethiol, amine compounds and imidazole ionic liquids at a mass ratio of 1:1:1, and °C, mechanically stirred for 24 hours to obtain a uniform and stable composite ionic liquid curing agent.

[0030] Described amine compound is dimethyl benzyl amine.

[0031] The imidazole ionic liquid is 1-ethyl-3-methylimidazole diethyl phosphate.

[0032] The 2,3-dithio(2-mercapto)-1-propanethiol is prepared from 1,3-bis(2-hydroxyethylthio)-2-propanol as a raw material through thiourea hydrochloride method and amine hydrolysis method Obtained, colorless and transparent, with an average molecular mass of 260.53.

[0033] The epoxy resin is novolac epoxy resin....

Embodiment 2

[0039] An epoxy resin glue for electronic devices, the epoxy resin glue includes A component and B component, wherein A component is 25 parts of composite ionic liquid curing agent; B component is: 69.5 parts of epoxy resin, accelerator 2 parts, 2 parts of thinner, 0.5 parts of plasticizer and 1 part of filler;

[0040] The preparation method of the composite ionic liquid curing agent is: weigh 2,3-(dimercaptoethyl)-1-propanethiol, amine compounds and imidazole ionic liquids at a mass ratio of 3:1:1, °C, mechanically stirred for 48 hours to obtain a uniform and stable composite ionic liquid curing agent.

[0041] The amine compound is triethylamine.

[0042] The imidazole ionic liquid is obtained by mixing 1-ethyl-3-methylimidazole acetate and 1-ethyl-3-methylthiocyanate according to a mass ratio of 1:1.

[0043] The 2,3-dithio(2-mercapto)-1-propanethiol is prepared from 1,3-bis(2-hydroxyethylthio)-2-propanol as a raw material through thiourea hydrochloride method and amine hy...

Embodiment 3

[0053] An epoxy resin glue for electronic devices, the epoxy resin glue includes A component and B component, wherein A component is 28 parts of composite ionic liquid curing agent; B component is: 74 parts of epoxy resin, accelerator 0.5 parts, 0.5 parts of diluent, 1 part of plasticizer and 1 part of filler;

[0054] The preparation method of the composite ionic liquid curing agent is: weigh 2,3-(dimercaptoethyl)-1-propanethiol, amine compounds and imidazole ionic liquids at a mass ratio of 6:1:1, °C, mechanically stirred for 36 hours to obtain a uniform and stable composite ionic liquid curing agent.

[0055] The amine compound is diethylenetriamine.

[0056] The imidazole ionic liquid is 1-ethyl-3-methylimidazole acetate.

[0057] The 2,3-dithio(2-mercapto)-1-propanethiol is prepared from 1,3-bis(2-hydroxyethylthio)-2-propanol as a raw material through thiourea hydrochloride method and amine hydrolysis method Obtained, colorless and transparent, with an average molecula...

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Abstract

The invention discloses an epoxy resin adhesive for electronic devices, and belongs to the technical field of adhesives. The epoxy resin adhesive comprises a component A and a component B, wherein thecomponent A is 25-35 parts of a composite ionic liquid curing agent; the component B is prepared from 65 to 75 parts of epoxy resin, 0 to 2 parts of an accelerant, 0 to 2 parts of a diluent, 0 to 2 parts of a plasticizer and 0 to 1 part of a filler. The epoxy resin adhesive prepared by the method is long in working life and high in reaction activity, can be quickly cured within 3 minutes at roomtemperature, remarkably shortens the forming period, and completely meets the requirement of a quick manufacturing technology in the field of electronic device bonding on the production efficiency.

Description

technical field [0001] The invention belongs to the technical field of adhesives, and in particular relates to an epoxy resin adhesive for electronic devices and a preparation method thereof. Background technique [0002] Epoxy resin curing is often used as an adhesive for electronic devices. Since the circuit boards and screens of computers, mobile phones, cameras, etc. cannot withstand high temperatures when the devices are bonded, it is required that the curing conditions of the adhesive should not be high temperature. One of the remarkable advantages of mercaptan curing agent is that it can cure epoxy resin at room temperature or even low temperature, and can be widely used as epoxy curing agent for electronic adhesives. [0003] Chinese patent CN201910544925 discloses a technology for synthesizing epoxy glue that can be quickly cured at low temperature. Using mercaptan as a curing agent, it is used as an adhesive for mobile phone camera modules. The problem of low curi...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J163/04C09J163/02C09J163/00C08G59/66C08G59/56
CPCC09J163/04C09J163/00C08G59/66C08G59/56Y02P20/54
Inventor 李佳林张洁金君素王宇博
Owner 郯城博化化工科技有限公司
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