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High-toughness and high-flame-retardant polyurethane circuit board material

A high flame-retardant, polyurethane technology, which is applied in the fields of compounds of group 5/15 elements of the periodic table, organic chemistry, chemical instruments and methods, etc., can solve the problem of unsatisfactory flame retardancy and toughness, insufficient flame retardancy and toughness Improve the curing rate and curing rate, improve the mechanical properties, and increase the crosslinking density.

Inactive Publication Date: 2018-02-09
ANHUI RUIFA COMPOSITES MFG
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the flame retardancy and toughness of polyurethane materials are not very ideal. When it is used in circuit boards, there are defects in flame retardancy and poor toughness, which limit its application. In order to improve the defects of polyurethane and meet the performance of circuit board materials, Often requires modification of polyurethane

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0014] A high-toughness and high-flame-retardant polyurethane circuit board material proposed by the present invention, its raw materials include: 70 parts of polyester polyol, 30 parts of 2,6-diisopropylphenylisocyanate, dimethyl biphenyl diisocyanate 40 parts, 18 parts of terephthalate, 3 parts of 1,4-butanediol, 14 parts of 4,4'-diamino-3,3'-dichlorodiphenylmethane, 1 part of dibutyltin dilaurate, catalyst 1.3 parts of DMP-30, 2 parts of dicyclopentadiene dioxide epoxy resin, 10 parts of polyvinyl chloride, 2 parts of maleic anhydride, 15 parts of nano calcium carbonate, α, ω-dihydroxypolydimethylsiloxane 2 parts of alkane, 10 parts of 1-oxo-4-hydroxymethyl-2,6,7-trioxa-1-phosphabicyclo[2.2.2]octane, and 3 parts of phosphorus-containing flame retardant.

Embodiment 2

[0016] A high-toughness and high-flame-retardant polyurethane circuit board material proposed by the present invention, its raw materials include by weight: 50 parts of polyester polyol, 55 parts of 2,6-diisopropylphenylisocyanate, dimethyl biphenyl diisocyanate 60 parts, 5 parts of terephthalate, 15 parts of 1,4-butanediol, 2 parts of 4,4'-diamino-3,3'-dichlorodiphenylmethane, 2.5 parts of dibutyltin dilaurate, catalyst 1 part of DMP-30, 14 parts of dicyclopentadiene dioxide epoxy resin, 3 parts of polyvinyl chloride, 10 parts of maleic anhydride, 3 parts of nano calcium carbonate, α, ω-dihydroxypolydimethylsiloxane 3.8 parts of alkane, 2 parts of 1-oxo-4-hydroxymethyl-2,6,7-trioxa-1-phosphabicyclo[2.2.2]octane, and 15 parts of phosphorus-containing flame retardant.

Embodiment 3

[0018] A high-toughness and high-flame-retardant polyurethane circuit board material proposed by the present invention, its raw materials include: 66 parts of polycarbonate diol, 38 parts of 2,6-diisopropylphenylisocyanate, dimethyl biphenyl diol 58 parts of isocyanate, 9 parts of p-phenylenedimethanol, 13 parts of 1,4-butanediol, 5 parts of 4,4'-diamino-3,3'-dichlorodiphenylmethane, 2.1 parts of dibutyltin dilaurate, 1 part of catalyst DMP-30, 12 parts of dicyclopentadiene dioxide epoxy resin, 4.8 parts of polyvinyl chloride, 8.5 parts of maleic anhydride, 4.8 parts of nano calcium carbonate, α, ω-dihydroxy polydimethylsilane 3.2 parts of oxane, 2.6 parts of 1-oxo-4-hydroxymethyl-2,6,7-trioxa-1-phosphabicyclo[2.2.2]octane, 5 parts of phosphorus-containing flame retardant;

[0019] Wherein, the epoxy value of dicyclopentadiene dioxide epoxy resin is 0.87;

[0020] The average particle diameter of described nano calcium carbonate is 20nm;

[0021] The phosphorus-containing fl...

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PUM

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Abstract

The invention discloses a high-toughness and high-flame-retardant polyurethane circuit board material which comprises polyester polyol, 2, 6-diisopropyl benzene isocyanate, dimethyl-biphenyl diisocyanate, terephthalyl alcohol, 1, 4-butanediol, 4, 4'-diamino-3, 3'-dichlorodiphenylmethane, dibutyltin dilaurate, catalyst DMP (dimethyl phthalate)-30, bicyclopentadiene dioxide epoxy resin, polyvinyl chloride, maleic anhydride, nano-calcium carbonate, alpha, omega-dihydroxy polydimethylsiloxane, 1-oxygen-4-hydroxymethyl-2, 6, 7-trioxa-1-phospha-dicyclo[2.2.2] octane and phosphorus-containing flame retardants. The high-toughness and high-flame-retardant polyurethane circuit board material has excellent flame resistance and toughness and is good in heat resistance and long in service life.

Description

technical field [0001] The invention relates to the technical field of polyurethane circuit board materials, in particular to a polyurethane circuit board material with high toughness and high flame retardancy. Background technique [0002] Polyurethane is known as the "fifth largest plastic" because of its excellent physical and mechanical properties, wear resistance, oil resistance, chemical corrosion resistance, tear resistance, ozone resistance, radiation resistance, strong shock absorption, and good adhesion. It is widely used in light industry, chemical industry, electronics, textile, medical treatment, construction, building materials, automobile, national defense, aerospace, aviation and other fields. However, the flame retardancy and toughness of polyurethane materials are not very ideal. When it is used in circuit boards, there are defects in flame retardancy and poor toughness, which limit its application. In order to improve the defects of polyurethane and meet t...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L75/06C08L75/04C08L63/00C08L27/06C08L83/04C08K13/02C08K5/1539C08K3/26C08K5/527C07F9/6574C08G18/76C08G18/66C08G18/42C08G18/44C08G18/32C08G18/18C08G18/24
CPCC08L75/06C07F9/65748C08G18/165C08G18/1816C08G18/242C08G18/3206C08G18/3215C08G18/3814C08G18/42C08G18/44C08G18/664C08G18/6651C08G18/7614C08G18/7685C08K2003/265C08K2201/003C08K2201/011C08L75/04C08L2201/02C08L2201/08C08L2203/20C08L2205/035C08L2205/04C08L63/00C08L27/06C08L83/04C08K13/02C08K5/1539C08K3/26C08K5/527
Inventor 李长峰
Owner ANHUI RUIFA COMPOSITES MFG
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