High-toughness and high-flame-retardant polyurethane circuit board material
A high flame-retardant, polyurethane technology, which is applied in the fields of compounds of group 5/15 elements of the periodic table, organic chemistry, chemical instruments and methods, etc., can solve the problem of unsatisfactory flame retardancy and toughness, insufficient flame retardancy and toughness Improve the curing rate and curing rate, improve the mechanical properties, and increase the crosslinking density.
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Embodiment 1
[0014] A high-toughness and high-flame-retardant polyurethane circuit board material proposed by the present invention, its raw materials include: 70 parts of polyester polyol, 30 parts of 2,6-diisopropylphenylisocyanate, dimethyl biphenyl diisocyanate 40 parts, 18 parts of terephthalate, 3 parts of 1,4-butanediol, 14 parts of 4,4'-diamino-3,3'-dichlorodiphenylmethane, 1 part of dibutyltin dilaurate, catalyst 1.3 parts of DMP-30, 2 parts of dicyclopentadiene dioxide epoxy resin, 10 parts of polyvinyl chloride, 2 parts of maleic anhydride, 15 parts of nano calcium carbonate, α, ω-dihydroxypolydimethylsiloxane 2 parts of alkane, 10 parts of 1-oxo-4-hydroxymethyl-2,6,7-trioxa-1-phosphabicyclo[2.2.2]octane, and 3 parts of phosphorus-containing flame retardant.
Embodiment 2
[0016] A high-toughness and high-flame-retardant polyurethane circuit board material proposed by the present invention, its raw materials include by weight: 50 parts of polyester polyol, 55 parts of 2,6-diisopropylphenylisocyanate, dimethyl biphenyl diisocyanate 60 parts, 5 parts of terephthalate, 15 parts of 1,4-butanediol, 2 parts of 4,4'-diamino-3,3'-dichlorodiphenylmethane, 2.5 parts of dibutyltin dilaurate, catalyst 1 part of DMP-30, 14 parts of dicyclopentadiene dioxide epoxy resin, 3 parts of polyvinyl chloride, 10 parts of maleic anhydride, 3 parts of nano calcium carbonate, α, ω-dihydroxypolydimethylsiloxane 3.8 parts of alkane, 2 parts of 1-oxo-4-hydroxymethyl-2,6,7-trioxa-1-phosphabicyclo[2.2.2]octane, and 15 parts of phosphorus-containing flame retardant.
Embodiment 3
[0018] A high-toughness and high-flame-retardant polyurethane circuit board material proposed by the present invention, its raw materials include: 66 parts of polycarbonate diol, 38 parts of 2,6-diisopropylphenylisocyanate, dimethyl biphenyl diol 58 parts of isocyanate, 9 parts of p-phenylenedimethanol, 13 parts of 1,4-butanediol, 5 parts of 4,4'-diamino-3,3'-dichlorodiphenylmethane, 2.1 parts of dibutyltin dilaurate, 1 part of catalyst DMP-30, 12 parts of dicyclopentadiene dioxide epoxy resin, 4.8 parts of polyvinyl chloride, 8.5 parts of maleic anhydride, 4.8 parts of nano calcium carbonate, α, ω-dihydroxy polydimethylsilane 3.2 parts of oxane, 2.6 parts of 1-oxo-4-hydroxymethyl-2,6,7-trioxa-1-phosphabicyclo[2.2.2]octane, 5 parts of phosphorus-containing flame retardant;
[0019] Wherein, the epoxy value of dicyclopentadiene dioxide epoxy resin is 0.87;
[0020] The average particle diameter of described nano calcium carbonate is 20nm;
[0021] The phosphorus-containing fl...
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