The invention discloses a preparation method of a PCB (
Printed Circuit Board), which belongs to the technical field of PCBs and comprises the following steps of: (1) silk-screening ink on a PCB substrate, and sequentially pre-baking, exposing, developing, baking, UV (
Ultraviolet) photocuring and
pickling; (2) carrying out silk-
screen printing of photosensitive ink on the pickled PCB substrate, and successively carrying out baking,
exposure and development; (3) carrying out
nickel-gold immersion treatment on the PCB substrate so as to deposit a
nickel-
gold layer on the surface of the PCB substrate; and (4) carrying out board milling on the PCB substrate to obtain the PCB
printed circuit board. The straightening treatment is added after the PCB substrate is subjected to routing, the straightening parameters are controlled, and the ink curing degree is improved and the surface is recombined at high temperature / certain pressure, so that the
contact angle of the ink surface is changed, the
contact angle of the ink surface is effectively improved, and the requirements of customers are met; and finally, the scrapping caused by substandard ink
contact angle is reduced, and the economic benefit is improved.