RF antenna, electronic label and method for making RF antenna

Abstract

The invention discloses a method of producing radio-frequency antenna which includes: etching loop and position for integrated circuit which is connected with loop; producing gap bridge of said antenna to accomplish production of radio-frequency antenna. The invention also discloses a radio-frequency antenna which includes loop, Gap Bridge, insulating layer, and position for integrated circuit, said position for integrated circuit is connected with loop. The invention also discloses an electronic mark which adopts said radio-frequency antenna. By adopting the invention, thickness of electronic mark can be decreased effectively; reliability of integrated circuit chip, Gap Bridge and antenna connection can be increased.

Description

technical field [0001] The invention relates to the technical field of electronic tags, in particular to a method for manufacturing a radio frequency antenna by using a resin single panel, and a radio frequency antenna and an electronic tag manufactured by using a resin single panel. Background technique [0002] With the rapid development of automatic identification technology, the application of electronic tags using radio frequency identification (Radio Frequency Identification, RFID) technology has become more and more extensive, in logistics and non-contact integrated circuit (Integrated Circuit, IC) cards, etc. all play an important role. [0003] Any electronic tag includes the RF antenna part and the RF IC chip part connected to the RF antenna. There are many ways to make the RF antenna, such as using copper clad plate, enameled wire winding, and screen printing. [0004] Among them, using copper-clad boards to make radio-frequency antennas is a relatively common ma...

AI Technical Summary

Problems solved by technology

[0007] The above-mentioned conductive sheet is usually called a carrier. The chip is placed on this carrier and then riveted to the wire end. This process is purely because the original chip manufacturer is an expedient measure for the expensive flip-packaging equipment in the early stage, because the contact surface is too large to cause the label to be damaged. The bending characteristics are very poor, and it is easy to cause the carrier and the coil to separate during use, which not only has high cost but also low yield

[0008] In actual use, users often need the thinner the electronic tag, the better, but this kind of electronic tag that uses a copper-clad plate to make the antenna, because the conductive sheet is used to connect the wire end of the antenna to make the bridge part of the antenna, the conductive sheet It itself will have a certain thickness, and the radio frequency IC chip of the electronic tag must be installed on it. It is difficult to make the finished product of the electronic tag very thin. Moreover, because the integrated circuit needs to be installed on the conductive sheet, this will cause the load of the conductive sheet. Increase, the increase in the load of the conductive sheet may cause the conductive sheet to loosen from the antenna, affecting the reliability of the connection between the RF IC chip, the conductive sheet and the antenna

[0009] In addition, the copper-clad board used above is a panel with copper foil on both sides. During the manufacturing process, the copper foil on both sides will be corroded, which will cause a large cost waste. Moreover, the corrosion of the copper foil will bring certain environmental pollution

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