Test equipment of steady state operation life in use for controlling junction temperature of transistor

Abstract

A device used for testing stead-state service lifetime of junction temperature on control transistor consists of test operation table, control unit formed by master-control computer and junction temperature control and measurement component, and power supply unit formed by two sets of DC voltage-stabilized power supplies for controlling and measuring junction temperature of tested sample transistor in order to raise credibility of steady-state service lifetime test on power transistor.

Description

1. Technical field [0001] The invention is a steady-state working life test equipment for controlling transistor junction temperature, which belongs to the technical field of semiconductor device reliability test. 2. Background technology [0002] Steady-state working life test is an effective method to assess the reliability of power transistors. The current international standard IEC747-7-1988 and the equivalent Chinese national standard GB / T4587-94 and the US military standard MIL-STD-750D will This test is stipulated as a mandatory test item. [0003] The elements of steady-state working life test conditions include: [0004] ① The electrical stress of the transistor. For example, the electrical stress of the power transistor steady-state working life test specified in IEC747-7, GB / T4587 and the US military standard MIL-STD-750 is the same as the specified case temperature T c Corresponding maximum rated power P totmax . [0005] ②The junction temperature T of the t...

AI Technical Summary

Problems solved by technology

However, the measurement shows that the junction-to-case thermal resistance R of the 3DD63 transistor packaged in the B2-01 type th(j-c) Generally not more than 1.3 degrees Celsius per watt (°C / W), the actual junction temperature T j ≤140°C, lower than the junction temperature required by the standard As a result, the purpose of eliminating defective products cannot be achieved within the specified test time, thereby reducing the credibility of the test

[0011] The existing high-power transistor aging equipment has some shortcomings: for example, most of them use water cooling to control the case temperature; during the test, the operator regularly measures the case temperature and controls the case temperature by manually adjusting the heat dissipation conditions.

However, the current method and equipment do not monitor the electrical parameters and thermosensitive electrical parameters of the sample tube during the test, and the test is terminated unless the sample tube is short-circuited, open-circuited, or other extreme conditions, otherwise the electrical parameters of the sample tube are only checked at the end of the test timing. test, which can also lead to a reduction in the reliability of the test

Images