Semiconductor structure and its making method

Abstract

The invention is concerned with the semiconductor junction structure, which is located on the basis of the cutting path area of the wafer. It includes: the first dielectric layer, the first testing land, and the protecting layer. It is: the first dielectric layer arranges on the basis; the first testing land arranges on the first dielectric layer; the protecting layer arranges on the first dielectric layer that is located around the first testing land; between both sides of the protecting layer and the first testing land is the groove that is at least located between the first testing land and the cutting path area.

Description

technical field [0001] The invention relates to a semiconductor structure and a manufacturing method thereof, in particular to a semiconductor structure and a manufacturing method thereof which prevent film layers on a cutting line from being delaminated during wafer cutting. Background technique [0002] With the advancement of technology, semiconductor manufacturing has become one of the most important industries. However, in order to meet different needs, the manufacturing process of semiconductors has become more and more complicated. Therefore, it is necessary to manufacture high-yield and low-cost Chips are becoming more and more difficult. [0003] In order to obtain information on the pros and cons of the process at any time during the semiconductor chip manufacturing process, a special design will be made on the periphery of the semiconductor chip (chip), that is, on the wafer with multiple parallel and perpendicular scribe lines. A plurality of test keys, and thes...

AI Technical Summary

Problems solved by technology

Since the wafer is covered with a variety of different material layers, during the wafer dicing operation, the material layers on the dicing road will have different material properties from each other, which will cause cracks or delamination on the dicing road. The delamination phenomenon often causes external moisture to enter the chip through the delamination, resulting in reduced reliability of components or damage to components on the chip.

[0007] For example, when the diamond cutter cuts along the dicing line of the wafer, the test pad 104 is affected by the stress and presses the protective layer 106, so that the protective layer 106 is delaminated, and then the protective ring (die sealring) located at the periphery of the chip is delaminated. ) is damaged, and external moisture will enter the chip through the interface between the protective layer 106 and the dielectric layer 102, reducing the reliability of the components on the chip

Images