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Modified maleimide end-sealed type polyimide resin composite and application thereof

A technology of polyimide resin and maleimide, which is applied in the direction of layered products, metal layered products, chemical instruments and methods, etc., can solve the problem of not meeting the requirements of large-scale industrial production, equipment and environmental conditions Too high, harsh condition control and other problems, to achieve low production costs, lower requirements for equipment and environmental conditions, and good stability

Active Publication Date: 2008-02-13
华烁电子材料(武汉)有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, because the polyimide precursor solution used - polyamic acid is easily degraded and the storage period is too short, it cannot well meet the needs of large-scale industrial production, and the condition control in the thermal imidization process is extremely harsh. Too high requirements on equipment and environmental conditions

Method used

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  • Modified maleimide end-sealed type polyimide resin composite and application thereof
  • Modified maleimide end-sealed type polyimide resin composite and application thereof
  • Modified maleimide end-sealed type polyimide resin composite and application thereof

Examples

Experimental program
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Effect test

Embodiment 1

[0038] Under the protection of nitrogen, 32.265 g (0.10 mol) of 3,3',4,4'-benzophenone tetracarboxylic dianhydride was refluxed in 250 ml of methanol for 1 to 5 hours to obtain the corresponding diacid diester. Distilled off, the remaining methanol was removed under reduced pressure, 27.338g (0.11mol) of 1,3-bis(3-aminopropyl)tetramethyldisiloxane, 31ml of chlorobenzene and 123ml of N- Methyl-2-pyrrolidone is dissolved and added to the diester of diacid. After fully stirring, react at 164°C for 6 hours to form an amino-terminated polyimide resin solution. After it is naturally cooled, add maleic acid 1.961 g (0.02 mol) of dianhydride, after reacting at room temperature for 8 hours, add 205 ml of chlorobenzene, reflux and separate water at 132°C for 32 hours, after cooling, pour the reaction solution into high-speed stirring absolute ethanol to obtain a precipitate After fully washing the obtained precipitate with absolute ethanol and anhydrous ether successively, and vacuum drying...

Embodiment 2

[0041] Under the protection of nitrogen, 24.851 g (0.08 mol) of 3,3',4,4'-diphenyl ether tetraacid dianhydride was refluxed in 174 ml of ethanol for 1 to 5 hours to obtain the corresponding diacid diester. The ethanol was evaporated After removing the remaining ethanol under reduced pressure, 20.369 g (0.09 mol) of 3,3′-dimethyl-4,4′-diaminodiphenylmethane was used, 20 ml of chlorobenzene and 98 ml of N-methane were used. After dissolving the 2-pyrrolidone, add it to the diacid diester. After fully stirring, react at 168°C for 10 hours to form an amino-terminated polyimide resin solution. After it cools naturally, add maleic acid 1.961 g (0.02 mol) of dianhydride, react at room temperature for 12 hours, add 274 ml of chlorobenzene, reflux and separate water at 130°C for 36 hours, after cooling, pour the reaction solution into high-speed stirring absolute ethanol to obtain a precipitate After fully washing the obtained precipitate with anhydrous ethanol and anhydrous ether successi...

Embodiment 3

[0044] Under the protection of nitrogen, 8.827 g (0.03 moles) of 3,3',4,4'-bipyromellitic dianhydride and 19.359 g of 3,3',4,4'-benzophenonetetracarboxylic dianhydride ( 0.06 mol) was refluxed in 230 ml of methanol for 1 to 5 hours to obtain the corresponding diacid diester. The methanol was distilled off, and the remaining methanol was removed under reduced pressure to remove 1.4-bis(4-aminophenoxy)-2 -Tert-butylbenzene 13.938g (0.04mol), 1.4-bis(4-aminophenoxy)-2.5-di-tert-butylbenzene 24.273g (0.06mol), use 25ml chlorobenzene and 150ml N-methyl After the -2-pyrrolidone is dissolved, it is added to the diacid diester. After fully stirring, it is reacted at 172°C for 16 hours to form an amino-terminated polyimide resin solution. After it is naturally cooled, add the maleic acid Acid anhydride 1.961 g (0.02 mol), after reacting at room temperature for 24 hours, add 425 ml of chlorobenzene, reflux and separate water at 130°C for 29 hours, after cooling, pour the reaction solution i...

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Abstract

The present invention is a modified maleimide-terminated polyimide resin compound and the application. The compound mainly consists of the maleimide-terminated polyimide resin, the allyl compound and the inorganic filling material. The maleimide-terminated polyimide resin uses the N-methyl-2-pyrrolidone as the solvent and is synthesized by the temperature-changing imidization method. The addition of the inorganic filling material of a certain amount in the modified resin obviously improves the permissible range of the thermal expansion coefficient differences between the polyimide film layer and the copper foil. The non-gel two-story flexible covering copper plate made by the modified terminated polyimide resin has the excellent heat resistance and can apply to the lead-free soldering; non-gel two-story flexible covering copper plate has the small crimping performance is small, the non-porous surface, the good dimensional stability, the good mechanical strength, the high peeling strength and folding endurance, and at the same time, has the low thermal expansion coefficient, dielectric constant and water-absorption rate.

Description

Technical field: [0001] The present invention relates to the field of flexible copper clad laminate substrates for flexible printed circuits and composite materials thereof, and relates to a method for synthesizing maleimide-terminated polyimide resin and the preparation of modified resin compositions thereof A non-adhesive two-layer method flexible copper clad laminate application. technical background: [0002] As stated in the specification of the Chinese invention patent application number 200710053151.3 submitted by the inventor, at present, with the rapid development of the electronics industry, the appearance and performance requirements of electronic products are getting higher and higher, short, small, light, thin and beautiful. Electronic products with excellent comprehensive performance have become the first choice of manufacturers and consumers. Therefore, the base material of flexible printed circuit boards will inevitably change from the three-layer method with glue...

Claims

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Application Information

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IPC IPC(8): C08L79/08C08K5/13B32B15/088C08K3/00
Inventor 范和平庄永兵
Owner 华烁电子材料(武汉)有限公司