Non-pin packaging structure of semiconductor element and packaging technology thereof

Abstract

The present invention relates to a semiconductor non-pin-packaging structure and its packaging process. The said structure includes chip substrate (1), wire-bonded pins substrate (2), chip (3), metal wire (4) and plastic package (5). Bottoms of the said chip substrate (1) and wire-bonded pins substrate (2) protrude bottom of the plastic package (5). The chip substrate is consisted of two parts, of which one is set in the plastic package, and the other is set outside the plastic package. The part in plastic package is consisted of several independent metal protrusions (1.1) which extend to outside of the plastic package, and all connect onto a complete metal sheet (1.2). The outer metal sheet (1.2) shows a pallet pattern to support the several independent metal protrusions (1.1) in the plastic package, and protrudes from the bottom of the plastic package (5), thus it consists another part of the chip substrate; the said chip is set on the metal protrusions of chip substrate. The present invention will not lead to layered and unattaching of the chip substrate, can be applied in high power, high heat-distributed productions.

Description

technical field [0001] The invention relates to a footless packaging structure of a semiconductor device and a packaging process thereof, belonging to the technical field of semiconductor packaging. Background technique [0002] The traditional semiconductor device chip carrier base exposed footless package structure uses a whole piece / a whole piece of metal as the chip carrier base (as shown in Figure 1) [0003] This chip carrying base structure has the following disadvantages: [0004] 1. A large amount of stress residue is likely to be generated in the packaged product, which will affect the reliability of the product. The materials in the package can be divided into three categories: metal (copper, iron, nickel, etc.), chip (silicon material) and plastic packaging compound. From the perspective of the thermal expansion coefficient of the material, the thermal expansion rate of the chip and the plastic packaging compound is similar, while the thermal expansion rate of t...

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Problems solved by technology

[0005] 2. The chip carrying base is easy to fall off, which will lead to product failure-the bonding surface between this whole and large metal structure and the plastic encapsulation compound is limited, so the structural strength is low; when the product is repeatedly mounted on the surface, the whole The chip carrying base of the block is easily pulled out of the plastic package due to force, causing the chip carrying base to fall off

[0006] 3. The flexibility of the chip carrying base is low, and it is difficult to meet the needs of a variety of chips of different sizes-this kind of block-shaped chip carrying base has a fixed size, and when encountering chips that are relatively long, wide or close to the size of the chip carrying base The design of the frame must be changed to match, which is costly and time consuming

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