Heat radiation substrate of electronic element

Abstract

A thermolytic underlay of the electronic component comprises a first metal layer, a second metal layer and a heat-conducting macromolecule dielectric insulated material layer. The said first metal layer surface bears the said electronic component like the LED component. The heat-conducting macromolecule dielectric insulated material layer is lapped between the first and second metal layer to form physical contact, wherein the interface includes at least one slightly rugged face with the roughness concentration larger than 7.0 Rz. The said slightly rugged face includes a plurality of grain diameters of the strumae mainly distributed between 0.1 and 100 micron. The coefficient of heat conductivity of the said heat-conducting macromolecule dielectric insulated material layer is larger than 1W / m is multiplied by K with thickness less than 0.5mm and contains fluorinated high molecular polymer (1) with the melting point higher than 150 degrees centigrade and the volume percent between 40% and 70%, and the heat-conducting stuffing (2) interspersed among the said fluorinated high molecular polymer with the volume percent between 40% and 70%.

Description

technical field [0001] The invention relates to a heat dissipation substrate, in particular to a heat dissipation substrate used for heat dissipation of electronic components. Background technique [0002] In recent years, white light-emitting diodes (LEDs) are the most promising emerging products that attract global attention. It has the advantages of small size, low power consumption, long life and good response speed, etc., and can solve the problems that incandescent bulbs were difficult to overcome in the past. LEDs are used in display backlights, mini projectors, lighting and automotive light sources and other markets are gaining more and more attention. [0003] At present, countries such as Europe, America and Japan are actively developing white light-emitting diodes as new light sources for lighting in this century based on the consensus of energy conservation and environmental protection. In addition, many of Tongjia's energy sources are currently imported, makin...

AI Technical Summary

Problems solved by technology

However, with the widespread application of high-power LEDs, their operating current can reach more than 1A, and the conventional printed circuit board (heat dissipation coefficient of about 0.3W / m·K) using glass fiber FR4 surface with copper foil is not enough to meet the heat dissipation requirements.

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