Heat conduction paste

A thermal conductivity, acrylate technology, applied in the field of thermal conductivity paste, can solve the problem of physical property degradation, achieve low viscosity, excellent storage stability, and excellent physical properties

Inactive Publication Date: 2008-03-19
TATSUTA ELECTRICWIRE & CABLE
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

Regarding this problem, if the viscosity is lowered by selecting a

Method used

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  • Heat conduction paste
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Examples

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Embodiment

[0058] Examples of the present invention are shown below, but the present invention is not limited to the following examples.

[0059] [Example]

[0060] The components shown in Table 1 were mixed in the ratio (weight ratio) shown in Table 1 to prepare liquid A and liquid B, respectively. In addition, the details of each component are as follows.

[0061] Acrylate resin: 2-hydroxy-3-acryloyloxypropyl methacrylate (80% by weight), triethylene glycol diacrylate (20% by weight)

[0062] Epoxy resin: Epoxy resin EP-4901E (manufactured by Asahi Denka Co., Ltd.) (80% by weight), ED-529 (manufactured by Asahi Denka Kogyo Co., Ltd.) (20% by weight)

[0063] Alkyd resin: EZ-3020-60-S (manufactured by Dainippon Ink & Chemicals Co., Ltd.)

[0064] Melamine resin: L-121-60 (manufactured by Dainippon Ink Chemical Industry Co., Ltd.)

[0065] Xylene resin: Nikanol PR-1540 (manufactured by Nippon Gas Chemical Co., Ltd.)

[0066] Silica powder: FB-24 (manufactured by Denki Kagaku Kogyo C...

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Abstract

The invention provides a thermal conductivity paste for screen printing with low viscosity, exothermicity, excellent storage stability and physical property of settability. The thermal conductivity paste is separated into A liquid containing acrylate resin and an epoxy resin hardener and B liquid containing epoxy resin and acrylate resin hardener. A thermally conductive filler is blended with one side or both sides of said A liquid and B liquid at a rate of 100 to 1000 weight section to total amount 100 weight section of said acrylate resin and an epoxy resin and the thermally conductive paste obtaining by mixing at a rate that a rate of a compounding ratio of said acrylate resin and an epoxy resin (however, weight %) is set to 10:90-90:10 before using said A liquid and B liquid.

Description

technical field [0001] The present invention relates to a thermally conductive paste (curable thermally conductive resin composition), and more specifically, to a thermally conductive paste used as an insulating material for a substrate. Background technique [0002] In recent years, as electronic equipment has become more functional and smaller and thinner, the density of chip components and semiconductors has increased significantly, and it has become more and more important to make the circuit board on which it is mounted with high heat dissipation. [0003] As such a highly heat-radiating circuit board, a method of mounting a heat-radiating fin on a heat-generating component using a heat-resistant adhesive is used. The so-called heat-resistant adhesive refers to an adhesive that is highly filled with an inorganic filler in a thermosetting or thermoplastic resin. Film-like heat-resistant adhesive made of permanent polyamideimide, thermosetting resin, and thermosetting el...

Claims

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Application Information

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IPC IPC(8): C09K5/08C08L33/08C08L63/00
CPCC08K5/0025C08L33/06C08L63/00C08L2205/03
Inventor 岩井靖梅田裕明
Owner TATSUTA ELECTRICWIRE & CABLE
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