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Multi-layer laminate and flexible copper-clad laminated substrate production method

A manufacturing method and technology for a copper clad layer, which are applied in the manufacture of printed circuit precursors, printed circuit manufacturing, circuit substrate materials, etc., can solve the problems of bonding strength between ultra-thin copper foil and resin layer, etc.

Inactive Publication Date: 2008-03-26
NIPPON STEEL CHEMICALL &MATERIAL CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] In addition, for flexible copper-clad laminate substrates that use ultra-thin copper foils that can be adapted to fine-line pattern etching, there is usually a problem with the adhesive strength between the ultra-thin copper foil and the resin layer. For example, in Patent Document 4, it is proposed that the adhesive strength is 0.7kN / m or more, but in fact, in COF applications that require fine wiring and high-temperature mounting, it is necessary to further improve the adhesive strength

Method used

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  • Multi-layer laminate and flexible copper-clad laminated substrate production method

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Embodiment

[0052] Hereinafter, the present invention will be specifically described based on examples and comparative examples, but of course the present invention is not limited thereto.

Synthetic example 1

[0054] 29.13 g (0.071 mol) of BAPP were dissolved in 294 g of DMAc. Next, 3.225 g (0.011 mol) of BPDA and 13.55 g (0.062 mol) of PMDA were added. Then, the stirring was continued for about 3 hours to carry out a polymerization reaction to obtain a polyimide precursor resin solution a of 35 poise (25° C.). In addition, the obtained polyimide precursor resin solution a was coated on a copper foil, dried at 130° C. for 5 minutes, and then heated to 360° C. over 15 minutes to complete imidization and produce polyimide In the case of an amine film, the coefficient of thermal expansion of the obtained film was measured, and the result was 55×10 -6 / K.

Synthetic example 2

[0056] 203.22 g (0.957 mol) DADMB and 31.10 g (0.106 mol) 1,3-BAB were dissolved in 3.076 kg of DMAc. Next, 61.96 g (0.211 mol) of BPDA and 183.73 g (0.842 mol) of PMDA were added. Then, the stirring was continued for about 4 hours to carry out a polymerization reaction to obtain a polyimide precursor resin solution b at 250 poise (25° C.). Furthermore, the coefficient of thermal expansion when producing a polyimide film in the same manner as in Synthesis Example 1 using the obtained polyimide precursor resin solution b was 15×10 -6 / K.

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Abstract

The purpose is to reduce the curling of a flexible cupper-clad laminated substrate which occurs when a resin solution is applied directly on an ultrathin copper foil with a heat-resistant carrier to form a resin layer on the substrate and then the carrier is peeled off. A method for producing a flexible copper-clad laminated substrate (6) having a resin layer (1) and an ultrathin copper foil (2), the method comprising, in an ultrathin copper foil with a heat-resistant carrier in which the ultrathin copper foil (2) is provided on the carrier (4) thorough a releasable layer (3), applying a resin solution onto the ultrathin copper foil, drying and thermally treating the resin solution to form the resin layer (1) which is composed of one or more layers on the ultrathin copper foil with the heat-resistant carrier, thereby producing a multi-layer laminate, and removing the carrier from the laminate. In the multi-layer laminate provided before the removal of the carrier, a force for causing the laminate to curl inwardly on the carrier-side is applied to the laminate and then the carrier is peeled off from the substrate. Thus, a flexible cupper-clad laminated substrate (6) can be produced which is reduced in the degree of curling.

Description

technical field [0001] The present invention relates to a method for manufacturing a flexible copper-clad laminated substrate and a multilayer laminate. Specifically, it relates to a method for manufacturing a flexible copper-clad laminated substrate using an ultra-thin copper foil with a heat-resistant A multilayer laminate obtained by coating a resin solution on an ultra-thin copper foil as a carrier. Background technique [0002] In recent years, as electronic information equipment has become more functional, lighter, thinner and shorter, higher density of substrate wiring is required, and it is necessary to have a flexible copper-clad laminate substrate that can adapt to the narrower pitch of wiring patterns. As a current circuit forming method, the mainstream is a metal surface etching method in which copper foil is etched to form wiring. However, in order to perform finer wiring processing such as 30 μm pitch or less, since the wiring shape becomes trapezoidal in the ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K1/03B32B15/08B32B15/088H05K1/02
CPCH05K2203/1476H05K3/025H05K1/036H05K2203/0759B32B15/08H05K1/03
Inventor 上野诚人财部妙子松下佑之
Owner NIPPON STEEL CHEMICALL &MATERIAL CO LTD
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