Circuit board information acquisition and conversion method, program, and device for the same

A conversion method and conversion device technology, applied in the direction of circuit heating device, circuit, printed circuit, etc., can solve the problems of improving analysis accuracy, not being able to simplify the analysis model, shortening the analysis time, etc., and achieve the effect of reducing the scale

Inactive Publication Date: 2008-04-02
FUJITSU LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0010] However, Patent Document 2 discloses a technique of providing through holes on an actual board, but does not disclose a technique of creating an analysis model for thermal design
Therefore, it is not possible to simplify the analysis model, shorten the analysis time, or improve the analysis accuracy based on the technique disclosed in Patent Document 2

Method used

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  • Circuit board information acquisition and conversion method, program, and device for the same
  • Circuit board information acquisition and conversion method, program, and device for the same
  • Circuit board information acquisition and conversion method, program, and device for the same

Examples

Experimental program
Comparison scheme
Effect test

example 1

[0094] Fig. 5 is a block diagram showing the configuration of a circuit board information acquisition and conversion device.

[0095] The circuit board information acquisition and conversion device 51 includes a circuit board design information input unit 52, a library 53, an analysis / conversion / processing unit 54 and a simulation unit 55.

[0096] The circuit board design information input unit 52 acquires circuit board design information (circuit board design data) generated based on the circuit diagram data input by the operator when designing the circuit board. Then, the circuit board design information is transferred to the analysis / conversion / processing unit 54. In this configuration, necessary information can also be obtained from the library 53 because in some cases, the wiring trace or the shape of the through hole is not included in the circuit board design information.

[0097] The library 53 is a memory. In the library 53, the characteristic information corresponding t...

example 2

[0125] Next, the circuit board simplification based on heat generation density will be explained.

[0126] FIG. 9 shows an example in which, based on the heat generation density calculated from the package area and the heat generation amount, a through hole is modeled as an analysis model for a mounting component whose heat generation density makes it vulnerable to thermal damage.

[0127] The analysis / conversion / processing unit 54 additionally includes a heat generation density determination unit, and a predetermined heat generation density determination value is recorded in a memory (bank 53 etc.).

[0128] Based on the heat generation amount of each mounted component, the heat generation density determination unit calculates the heat generation density that affects the vicinity of the components on the circuit board. Compare the calculated heating density and the determined value of heating density with each other. When the calculated heating density is equal to or greater than...

example 3

[0134] In Example 3, the heat generation density distribution of the analysis model is explored according to the circuit board design information, and the through holes are arranged in areas with large heat generation density or extremely different heat density, and no through holes are provided in other areas.

[0135] Similar to Example 2, a heat generation density determination unit for calculating heat generation density is provided. In addition, the analysis / conversion / processing unit 54 is provided with a region setting unit and the like, and the region as shown in FIG. 10 is determined (region setting processing). The area is divided on the board as shown by the dotted line. In this example, the area is square, but the scope of the present invention is not limited to this shape. In addition, the area may be determined based on the operator's selection.

[0136] In each area, the heating density calculated by the heating density determination unit is compared with the heatin...

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Abstract

A circuit information acquisition and conversion device, a method, and a program therefor for acquiring a layer configuration, wire traces and shapes of via holes from circuit board design information; optimizing, before conversion into an analysis model, the output target range of the via holes on the basis of a package area, heat density distribution, and power consumption; and creating an analysis model that is suitable for a purpose of the analysis are provided.

Description

Technical field [0001] The present invention relates to the conversion of circuit board information used to support the thermal design of the circuit board, and in particular to a technique for improving the accuracy of thermal analysis. Background technique [0002] In recent years, in the design of circuit boards (such as a multilayer printed circuit board as a mounting board on which an LSI package board is mounted, etc.), because the heat source on the circuit board has a great influence on the thermal design of the entire circuit board, In order to calculate the thermal influence of the heat source, the simulation and manufacturing of the prototype are repeatedly performed. Therefore, various types of simulation systems and programs have been developed to support the thermal design of circuit boards. [0003] In thermal design, in order to improve the accuracy of the circuit board thermal analysis (using the finite volume method, etc.), it is important to refine the heat dis...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G06F17/50
CPCH05K1/0201H05K3/0005H05K1/115G06F17/5081G06F2217/80H05K2201/09536G06F17/5018G06F2217/16G06F30/23G06F30/398G06F2111/10G06F2119/08H01L21/00
Inventor 植田晃松下秀治
Owner FUJITSU LTD
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