Copper covered electronic panel powder copy mold plastic and method for producing the same
A molding compound and copper-clad technology, which is applied in the field of recycling of copper-clad electronic board powder, can solve problems such as difficult to oily and difficult to recycle
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[0080] The preparation method of the present invention is described in detail as follows:
[0081] Knead
[0082] The kneading intensity of the present invention should be sufficient to allow thorough mixing of the knead.
[0083] The kneading temperature of the present invention is maintained at 70°C±5°C.
[0084] The kneading action makes the raw material itself produce frictional heat, and the jacket or outer wall of the kneader can be heated to heat the kneaded material. The heating temperature is preferably limited to about 70°C, and the steam water is discharged to the outside through the exhaust pipe on the upper part of the kneader cover. The intermediate raw materials are dehydrated under the condition of kneading and the resin is matured at an appropriate temperature, and the three aspects and processes are carried out simultaneously to obtain the replica molding compound of the present invention.
[0085] Post-processing
[0086] The post-processing step of the ...
Embodiment 1
[0100] The preparation of embodiment 1 liquid phenolic resin
[0101] Raw materials: phenol 100g, formaldehyde 125g, sodium hydroxide 0.8g.
[0102] The synthetic reaction of phenol and formaldehyde is carried out in a reaction pot equipped with a condensation device. First add formaldehyde and phenol into the pot, start the agitator to stir for about 10 minutes, and then add sodium hydroxide after stirring evenly (sodium hydroxide is added with soaking water before feeding), and fully stir after adding. Start the heating reaction. When the reaction temperature reaches 75°C, stop the heating, and add cooling water to the condensing device for cooling, because the chemical exothermic reaction of the chemical raw materials in the reaction pot will start at this time, so the reaction should be controlled by cooling The heating reaction speed in the pot ensures safe operation. When the temperature in the pot reaches 98° C., keep this temperature, carry out the reflux reaction fo...
Embodiment 2
[0104] The preparation of embodiment 2 liquid phenolic resins
[0105] Raw materials: phenol 100g, formaldehyde 130g, sodium hydroxide 0.9g.
[0106] The synthetic reaction of phenol and formaldehyde is carried out in a reaction pot equipped with a condensation device. First add formaldehyde and phenol into the pot, start the agitator to stir for about 10 minutes, and then add sodium hydroxide after stirring evenly (sodium hydroxide is added with soaking water before feeding), and fully stir after adding. Start the heating reaction, when the reaction temperature reaches 70°C, stop heating, and add cooling water to the condensing device to cool, because at this time the chemical exothermic reaction of the chemical raw materials in the reaction pot will start, so the reaction should be controlled by cooling The heating reaction speed in the pot ensures safe operation. When the temperature in the pot reaches 95° C., keep this temperature, carry out the reflux reaction for about...
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