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Bisphenol A-type polyimide material and method for making same

A polyimide and aromatic diamine technology, applied in the field of bisphenol A type polyimide film, can solve the problems of complex process, solvent residue, film gap and the like

Inactive Publication Date: 2008-05-14
TONGJI UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] In order to overcome the shortcomings of solvent residues, gaps in the film layer, and complicated processes in the preparation of fully aromatic polyimides by the solution method in the prior art, the purpose of the present invention is to prepare a class of bisphenol A type fully aromatic polyimides by vapor deposition polymerization. Imine is a special polymer material. The polyimide prepared by this method has higher purity, uniform and dense film thickness, and better performance than the film prepared by the commonly used solution method.

Method used

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  • Bisphenol A-type polyimide material and method for making same
  • Bisphenol A-type polyimide material and method for making same
  • Bisphenol A-type polyimide material and method for making same

Examples

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Effect test

Embodiment 1

[0024] All the raw materials used were purchased from Shanghai Synthetic Resin Research Institute and were chemically pure.

[0025] The ratio of raw materials used is as follows:

[0026] 2,2'-bis(4-dicarboxyphenoxyphenyl)propane dianhydride (BSAA) 1.1 parts (number of moles)

[0027] 4,4'-(isopropylidene) bis(4-phenoxyaniline) (BAPP) 1 part (number of moles)

[0028] Preparation of BSAA / BAPP type PI membrane:

[0029] Put BSAA and BAPP on two copper heating boats respectively, and control the temperature of the two to 255°C and 225°C (at the same time) respectively through a transformer. The system vacuum is higher than 1×10 -3 Pa, while evaporating for 20-30 minutes, the prepolymer polyamic acid film of polyimide is polymerized and deposited on the substrate. Then put the polyamic acid film deposited on the substrate into a vacuum oven for heat treatment, the temperature is 250° C., the heat treatment time is 2 hours, and the vacuum degree is about 4 Pa. After heat tre...

Embodiment 2

[0040] The ratio of raw materials used is as follows:

[0041] 2,2'-bis(4-dicarboxyphenoxyphenyl)propane dianhydride (BSAA) 1.1 parts (number of moles)

[0042] 1 part of 4,4'-diaminodiphenyl ether (ODA) (number of moles)

[0043] Preparation of BSAA / ODA type PI membrane:

[0044] Put BSAA and ODA on two copper heating boats respectively, and control the temperature of both to 255°C and 160°C (at the same time) respectively through a transformer. The system vacuum is higher than 1×10 -3 Pa, while evaporating for 20-30 minutes, the prepolymer polyamic acid film of polyimide is polymerized and deposited on the substrate. Then put the polyamic acid film deposited on the substrate into a vacuum oven for heat treatment, the temperature is 250° C., the heat treatment time is 2 hours, and the vacuum degree is about 4 Pa. After heat treatment, a dehydration-cyclized BSAA / ODA polyimide film is obtained.

[0045] The performance measurement method and results of BSAA / ODA type PI fi...

Embodiment 3

[0047] The ratio of raw materials used is as follows:

[0048] 2,2'-bis(4-dicarboxyphenoxyphenyl)propane dianhydride (BSAA) 1.1 parts (number of moles)

[0049] 1 part of p-diaminodiphenylmethane (MDA) (number of moles)

[0050] Preparation of BSAA / MDA type PI membrane:

[0051] Put BSAA and MDA on two copper heating boats respectively, and control the temperature of the two to 255°C and 170°C (at the same time) respectively through a transformer. The system vacuum is higher than 1×10 -3 Pa, while evaporating for 20-30 minutes, the prepolymer polyamic acid film of polyimide is polymerized and deposited on the substrate. Then put the polyamic acid film deposited on the substrate into a vacuum oven for heat treatment, the temperature is 250° C., the heat treatment time is 2 hours, and the vacuum degree is about 4 Pa. After heat treatment, a dehydration-cyclized BSAA / MDA type polyimide film is obtained.

[0052] The performance measurement method and results of BSAA / MDA type...

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Abstract

The invention belongs to the technical field of macromolecular materials and macromolecular synthesis, and in particular relates to the preparation of bisphenol A polyimide film by vapor deposition polymerization. The method for preparing polyimide is characterized in that bisphenol A dianhydride and diamine monomers are sublimated in vacuum and polymerized during vapor phase deposition. The polyimide prepared by this method not only maintains the good thermal stability and chemical stability of polyimide prepared by the traditional method, but also overcomes the shortcomings of the traditional method. The prepared polyimide film is uniform and dense, No pinholes, no catalyst, no solvent residue, high purity, and simplified reaction steps.

Description

technical field [0001] The invention belongs to the technical field of polymer materials and polymer synthesis, and in particular relates to a bisphenol A polyimide film prepared by a vapor deposition polymerization method. Background technique [0002] As a special polymer material with excellent performance, polyimide has good thermal properties (the decomposition temperature of fully aromatic polyimide is generally around 500°C), excellent mechanical properties, stable chemical properties and Good dielectric properties, etc., widely used in aerospace, microelectronics, nano, liquid crystal, separation membrane and other fields. There are many kinds of polyimides, and there are also multiple ways in the synthesis. The most commonly used method at present is the solution method (Strunskus T., Grunze M., Polyimides, Dekker, New York, 1996: 187), but the solution method also has some Deficiency, the synthetic reaction of polyimide prepared by solution method is carried out i...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08G73/10C08J5/18
Inventor 浦鸿汀李媛媛袁俊杰
Owner TONGJI UNIV
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