Polyurea film and method of forming the same

Abstract

A polyurea film excelling in transparency, light stability and mass productivity is formed on a resin molding substratum in accordance with a vacuum vapor deposition polymerization technique. The polyurea film is obtained by a vacuum vapor deposition polymerization conducted using an aromatic alkyl, or alicyclic, or aliphatic diisocyanate monomer and an aromatic alkyl, or alicyclic, or aliphatic diamine monomer. The diisocyanate monomer and the diamine monomer are selected from among those in relationship such that a difference in activation energy needed for detachment from the substratum is 10 kJ or less.

Description

technical field [0001] The invention relates to a polyurea film formed on a base material by a vacuum evaporation polymerization method and a film forming method thereof. Background technique [0002] Conventionally, polyurea films have been formed by the reaction of diamine and diisocyanate represented by the following formula 1, and there are, for example, methods represented by the following (a) to (d). [0003] (a) Patent Document 1 describes a method for forming a synthetic resin film (vacuum evaporation polymerization method), which involves evaporating two or more raw material monomers in a vacuum chamber and polymerizing them on a substrate. . Among them, it is described that raw material monomers are sequentially polymerized (polycondensation and polyaddition), and 4,4'-diphenylmethane diisocyanate (aromatic diisocyanate) and 4,4'-diaminodiphenyl ether (aromatic diisocyanate) are used to form Polyurea (urea resin) film of group diamine). [0004] (b) Patent Docum...

AI Technical Summary

Problems solved by technology

When the base material is metal or inorganic (good thermal conductivity, does not soften, plasticize, or carbonize at high temperatures like resin), or if figure 2 When the shape of the substrate 1 held on the substrate fixing jig 1 shown in (a) is flat and thin (it can be uniformly cooled by the substrate fixing jig and a surrounding cold source, or uniformly heated by a heat source), it is possible to control substrate temperature, but as figure 2 In the case of a resin molded article having a three-dimensional structure on the surface of the substrate 2 shown in (b) (hereinafter referred to as "resin molded article"), it is very difficult to make the temperature of the substrate surface uniform, and it is very difficult to control the temperature of the substrate. The problem

Images