Wiring substrate and semiconductor device using the same

Abstract

According to the present invention, a plurality of semiconductor devices having semiconductor chips 13 molded on a semiconductor package substrate 1 by a molding resin 15 can be manufactured by forming recesses 10 around each semiconductor package substrate 1 composing a substrate 8 for a BGA package, and in the state where a molding resin 15 is filled on the substrate 8 including the recesses 10 for resin molding, cutting the substrate 8 and the molding resin 15 along partition lines 9.

Description

technical field [0001] The present invention relates to a wiring substrate composed of a plurality of semiconductor module substrates on which semiconductor chips are mounted, used in, for example, a BAG package, and a semiconductor device using the wiring substrate. Background technique [0002] In recent years, in order to cope with the miniaturization of electronic equipment such as mobile communication equipment, miniaturization and high density are required even for semiconductor devices. In addition, with the development of high performance and multi-functionalization of electronic equipment, in semiconductor devices, external terminals tend to have multiple pins, and BAG components and LAG components arranged in arrays on the bottom surface of semiconductor components are mostly used. [0003] Such a semiconductor device is obtained by cutting the wiring substrate and sealing resin for each semiconductor module substrate in a state where a semiconductor chip is sealed...

AI Technical Summary

Problems solved by technology

[0011] In this way, if the wiring 5 for plating is exposed from the side of the semiconductor device, when it is mounted on a printed circuit board of an electronic device in a subsequent inspection process, the socket for inspection or a suction tool during mounting of a printed circuit board may come into contact with the wiring for plating. At this time, the wiring 5 for electroplating is often deformed and an electrical short circuit occurs between adjacent wiring 5 for electroplating.

In addition, due to the adhesion of impurity ions and the moisture absorption of the semiconductor device, the plating wiring 5 causes migration on the side surface.

Due to the above reasons, there is a problem that the reliability of semiconductor devices decreases

[0012] In addition, before cutting the wiring board 8 and the sealing resin 15 with the dividing line 9 to divide into each semiconductor device, almost all the internal wiring 3 is in a state of being electrically connected (short-circuited) by the wiring 5 for plating, so the 8, it is difficult to conduct an electrical inspection of each semiconductor component substrate 1, and semiconductor chips 13 may be mounted on unqualified semiconductor component substrates 1, and as a result, there is also a problem that the productivity of semiconductor devices decreases.

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