Annealing method for producing large area two-side thallium series film

A large-area, annealing technology, applied in the direction of ion implantation plating, metal material coating process, coating, etc., can solve the problems of film surface shedding, uneven pattern, complex device, etc., achieve low cost, avoid pollution, improve Effect of Diffusion Velocity

Inactive Publication Date: 2008-06-11
INST OF PHYSICS - CHINESE ACAD OF SCI
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

For example, the vertical placement of the thallium source and the precursor film will cause the thallium component in the film to segregate along the vertical direction (Chen H.Q, Johansson L.-G and Ivanov Z G 2000 Appl.Phys.Lett.77 1197; Ginley D S, Kwak J F, Venturini E L, Morosin B and Baughman R J1989 Physica C 160 42); as another example, wrapping the adjacent thallium source and precursor film with gold foil will cause local peeling and uneven patterns on the film surface
There are quite a lot of reported post-annealing layout structures, some of which are more complicated, and some are more expensive, such as the use of special gold crucibles with high thermal conductivity and chemical stability (Schneidewind H, Manzel M, Bruchlos G and KirschK 2001 Supercond.Sci.Technol .14 ​​200) or disposable quartz sealed tubes (Ginley D S "Tl-based HTSC films for microelectronic applications" 9th chapter in 'Thallium-Based High-Temperature Superconductor s'edited by Hermann A M and Yakhmi S V)

Method used

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  • Annealing method for producing large area two-side thallium series film

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0028] The composition is Tl 2 Ba 2 CaCu 2 o 8 (m=2, n=2) Two-inch double-sided thallium-based high-temperature superconducting thin film. The used substrate and single crystal block materials are all lanthanum aluminate (001) oriented single crystals. The thickness of the substrate is 0.5 mm, and the thickness of the single crystal block is 1.5 mm. The annealing temperature is 730°C, and the precursor film is Ba with a thickness of 500nm without thallium. 2 CaCu 2 o Y Amorphous thin film, thallium source is Tl 2 Ba 2 Ca 2 Cu 3 o 10 blocks. The annealing time was 3 hours, and the argon gas flow rate was 25ml / min, and finally a sample with the same electrical properties of the superconducting thin film on both sides was obtained. This annealing process was repeated several times to prepare multiple samples. The superconducting critical temperature T of each sample was obtained by the conventional four-lead measurement method c All within 103-108.5K; the supercond...

Embodiment 2

[0030] The thallium source and precursor film with the same composition as in Example 1 are used, the wafer and single crystal block used are also lanthanum aluminate, the orientation is (001), the annealing temperature is 750°C, the thickness of the precursor film is 600nm, and the annealing time is 3.5 hours, the argon flow rate is 30ml / min, and finally obtain a sample with the same electrical properties of the superconducting film on both sides, and obtain the superconducting critical temperature T through the above-mentioned various measurement methods. c , superconducting critical current density J c (77K) and film microwave surface resistance R S (77K, 10GHz) are also in 103-108.5K, 1-3.0×10 6 A / cm 2 and less than 500µΩ range.

Embodiment 3

[0032] The thallium source and precursor film of the same composition as in Example 1 are adopted, the used wafer and single crystal block are all strontium titanate, the orientation is (001), the annealing temperature is 730 ° C, the thickness of the precursor film is 500 nm, and the annealing time is 3 hours, the argon flow rate is 25ml / min, and finally a superconducting sample with consistent electrical properties on both sides of the film is obtained. The superconducting critical temperature T is measured by the above-mentioned various measurement methods. c , superconducting critical current density J c (77K) and film microwave surface resistance R S (77K, 10GHz) are also in 103-108.5K, 1-3.0×10 6 A / cm 2 and less than 500µΩ range.

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Abstract

The invention discloses an annealing method for preparing large area double-faced thallium based membrane. The invention comprises the steps that a plurality of single crystal tablets which has the same thickness and the same material and crystal orientation with the substrate of the double-faced forehand membrane is adopted, two thallium source with the same shape and after high temperature solid reaction sintering and a piece of sample equipped with the double-faced forehand membrane for annealing are equidistantly divided along the vertical direction in a vertically symmetrical way, and the sample equipped with the double-faced forehand membrane is arranged in the middle of the thallium source and the center aimed at the center of the upper and the lower thallium source with larger area than the membrane; the above integral structure is reversed into a sealed crucible, and put into a pipe furnace together with the crucible; then the annealing is performed. The electrical property of the double-faced membrane of the sample after annealing has very strong consistency and very good uniformity.

Description

technical field [0001] The invention belongs to the field of post-treatment of thin films, and specifically relates to an annealing method for preparing large-area double-sided thallium-based thin films. Background technique [0002] In recent years, the research on high critical temperature oxide superconducting thin films and their devices has achieved rapid development. Many devices and subsystems have gone out of the laboratory and entered the field of practical application. There are already thousands of mobile communication receiver front ends using high temperature superconducting filters. High-quality large-area double-sided high-temperature superconducting thin films are one of the necessary conditions for the preparation of high-temperature superconducting microwave devices with high band edge steepness and low insertion loss at the microwave low-frequency end. So far, the technologies for preparing high-temperature superconducting thin films can be roughly divide...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C23C14/58C23C14/34C23C14/08C23C14/54
Inventor 陈莺飞王萍李洁徐晓平黎松林田海燕潘军郑东宁
Owner INST OF PHYSICS - CHINESE ACAD OF SCI
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