Composition containing bismaleimide oligomer and preparing method thereof

Abstract

The invention relates to a combination containing bismaleimide oligomer and a preparation method thereof. The combination containing bismaleimide oligomer comprises the bismaleimide oligomer accounting for more than 75 percent of the total solid content of the combination, wherein, the combination containing bismaleimide oligomer is obtained from the batch reaction between bismaleimide monomer and barbituric acid.

Description

technical field [0001] The present invention relates to a composition containing bismaleimide oligomer, especially a composition containing high-purity bismaleimide oligomer. Background technique [0002] Bismaleimide (BMI) polymer has a high glass transition temperature (Tg), good thermal stability, strong mechanical properties, excellent material embedding properties and electrical properties, and high hardness due to its compact and rigid structure. (toughness) and other advantages, often used in high temperature stable heat-resistant circuit board (circuit board), high temperature adhesive (adhesive), copper foil laminate (Copper Clad Laminate, CCL) and copper foil glued material (Resin Coated Copper, RCC) and other application products. However, the bismaleimide polymer after hardening and polymerization tends to form a polymer with a high network structure, which is not only very brittle, but also has poor adhesion. , high hygroscopicity, low solvent solubility, diff...

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Problems solved by technology

However, the overall modification degree of the material and the gain effect of the characteristic function are still very limited, the flexibility and expansion of the application will be restricted, the process cost is high, and the processing procedures and conditions are relatively strict. Disadvantages of the field of application

[0007]However, the above-mentioned modified bismaleimide compositions are used to improve the characteristics and functions of organic resin materials, although they can overcome and solve the problem of material application. processability problems, and can improve the performance of some materials; however, when the bismaleimide is modified, if the three-dimensional configuration, molecular weight and size of the structure cannot be well controlled, the bismaleimide The variability of the modified structure of the imide body will be too complicated and difficult to grasp, resulting in the resin material after kneading or structure modification, due to differences in internal structure homogeneity and polymerization hardening stress distribution, etc., still have Extremely brittle and unable to obtain balanced mechanical properties

Therefore, although the prior art has proposed many solutions, it is used to improve the brittleness (brittleness), poor adhesiveness, high hygroscopicity, difficult processing and high manufacturing efficiency that will cause limitations in use or application of bismaleimide polymers. Shortcomings such as cost; However, the improvement methods proposed by the prior art can only focus on solving single or partial problems due to the use of bismaleimide monomers or bismaleimide polymers with a higher degree of polymerization. It does not take into account the configuration, three-dimensional configuration, molecular weight, size and other factors presented by the material structure. It is difficult to control the effect and interaction relationship of the overall functional properties of the material, and it cannot show high purity. Due to the hyper branch architecture and functions of multi-functional bismaleimide oligomers, the gain effect is often not comprehensive, and the overall improvement of material properties and functions is also quite limited. In the future, the demand for multi-level functional materials such as the photovoltaic industry, solar cell industry, liquid or colloidal or solid state battery industry, and functional composite material industry will be a bottleneck that is difficult to break through.

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