Method for improving photolithography exposure energy homogeneity using grey level compensation

Abstract

The invention discloses a method for using gray scale compensation to improve photo-etching exposure energy uniformity, with wide application in non-mask photo-etching machine which uses spatial light modulator as image generator. The non-mask photo-etching machine provided with a spatial light modulator as image generator uses the gray scale modulation of the spatial light modulator, according to the image light strength distribution information of photo-etching objective lens collected by a CCD to modulate the light output of each pixel unit of the spatial light modulator to change the emission light field distribution on the image plane of the photo-etching objective lens. The invention uses the light strength distribution measured in the integration of some time or uses the energy distribution of the light emitted from each image plane position in a certain exposure time to make the exposure energy of each position uniform on the image plane. The invention can effectively reduce the design and assembly hardness of the lighting system of traditional photo-etching machine and reach better exposure energy uniformity.

Description

technical field [0001] The invention belongs to a method for correcting the uniformity of exposure energy of a photolithography machine, in particular to a method for correcting the uniformity of exposure energy of a maskless photolithography machine using a spatial light modulator. Background technique [0002] Photolithography is used to print characteristic patterns on the surface of substrates, such as substrates used in the manufacture of semiconductor devices, various integrated circuits, flat-panel displays (such as liquid crystal displays), circuit boards, biochips, micromechanical Substrates for electronic chips, optoelectronic circuit chips, etc. Often used substrates are semiconductor wafers or glass substrates with light-sensitive media on the surface. [0003] During lithography, a wafer is placed on a wafer stage, and a pattern of features is projected onto the wafer surface by an exposure device within the lithography apparatus. Although projection optics ar...

AI Technical Summary

Problems solved by technology

[0009] The lighting system of the existing lithography machine usually requires the uniformity of the light field to be within 1%. The design and processing requirements and difficulty are very strict. It is difficult to meet the requirements of light energy utilization and light uniformity at the same time, and the detection of lighting uniformity It needs to be tested on the image plane together with the imaging lens, which puts forward higher requirements for assembly adjustment

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