Acid etching solution used for copper or copper alloy surface and surface treatment method

A technology of micro-etching solution and copper alloy, which is applied in the field of acid micro-etching solution and surface treatment, and surface treatment of high-density interconnected printed circuit boards, can solve the problems of increasing processing procedures, and achieve the effect of simple and easy processing method.
CN101230461BInactive Publication Date: 2010-08-04SHANTOU ULTRASONIC PRINTED BOARD NO 2 FACTORY
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
SHANTOU ULTRASONIC PRINTED BOARD NO 2 FACTORY
Publication Date
2010-08-04
Estimated Expiration
Not applicable · inactive patent

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Abstract

The invention relates to an acidic microetching solution used for the surface of copper or copper alloys, is characterized in that the solution contains poly-guanidine. The invention still relates to a method of treating the surface of copper or copper alloys and includes the following steps: firstly, the acidic microetching solution of the invention is used for contacting the surface of copper or copper alloys; and secondly, the surface is covered by an organic coating. Compared with the prior art, the invention has the advantages that the following requirements can be met at the same time, i.e. firstly, the copper surface is provided with a desirable roughness, which can provide enough adhesive power for the combination of the copper surface and the organic coating (a dry film for example); secondly, the treated copper surface is light-colored, friction-resistant and oxidation-resistant; thirdly, the copper surface does not need cleaning in advance, and the microetching and degreasing can be accomplished at the same time; and fourthly, the microetching amount can be as small as possible to meet the lamination requirement of the selective dry film.
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Description

technical field

[0001] The invention relates to an acidic microetching solution and a surface treatment method for copper or copper alloy surfaces, more specifically to an acidic microetching solution for high-density interconnected printed circuit boards and the use of the acidic microetching solution Method for surface treatment of high density interconnect printed circuit boards. Background technique

[0002] In the manufacturing process of high-density interconnect printed circuit boards (ie, HDI-PCB), the surface of copper or copper alloy needs to be treated before covering the organic coating layer to improve the bonding of the organic coating layer and the copper surface. These organic coating layers include but are not limited to various dry films such as dry films resistant to acid etching, dry films resistant to electroplating in alkaline etching processes, and selective dry films in immersion gold processes. Depending on the purpose of use, the organic coating re...

Claims

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