Single-component high peel strength epoxy resin adhesive and preparation method thereof

An epoxy resin and adhesive technology, applied in the direction of epoxy resin glue, adhesive, adhesive type, etc., can solve the problems of long storage time, difficult to achieve curing time, etc., to improve performance, take into account storage stability, improve curing Effects of speed and degree of cure

Active Publication Date: 2012-05-23
SHANGHAI HUITIAN NEW CHEMICAL MATERIALS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0009] The above one-component epoxy resin adhesives mainly focus on the research of curing time and storage period. For the existing two-component or single-component epoxy resin adhesives, it is difficult to achieve both short curing time and storage time. Long, and has the characteristics of high peel strength and high shear strength

Method used

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  • Single-component high peel strength epoxy resin adhesive and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0057] The one-component high peel strength epoxy resin adhesive includes the following formula by weight:

[0058] Epoxy resin A: 20 parts of polyurethane modified epoxy resin

[0059] Epoxy resin B: 30 parts of bisphenol F epoxy resin

[0060] Toughening agent: 10 parts of liquid carboxylated nitrile rubber

[0061] Thinner: Lauryl Glycidyl Ether 13 parts

[0062] Coupling agent: 1 part of γ-epoxypropoxytriethoxysilane

[0063] Filler: Fumed white carbon black 1 part

[0064] Curing agent master paste 25 parts

[0065] Wherein, curing agent mother paste comprises following formula by weight part:

[0066] Epoxy resin: bisphenol F epoxy resin 64 parts

[0067] Stabilizer: 1 part fumaric acid

[0068] Latent curing agent: imidazole latent curing agent (Asahi Denka EH-4232)

[0069] 35 copies

[0070] The preparation method of single-component high peel strength epoxy resin adhesive comprises the steps:

[0071] (1) Pre-prepared cu...

Embodiment 2

[0077] The one-component high peel strength epoxy resin adhesive includes the following formula by weight:

[0078] Epoxy resin A: CTBN modified epoxy resin 15 parts

[0079] Epoxy resin B: 30 parts of bisphenol F epoxy resin

[0080] Toughener: shell / core polymer (Rohm and Haas EXL-2655)

[0081] 20 copies

[0082] Coupling agent: 1 part of γ-epoxypropoxytriethoxysilane

[0083] Filler A: Fumed white carbon black 1 part

[0084] Filler B: 18 parts of light calcium carbonate

[0085] Curing agent master paste 15 parts

[0086] The formula of curing agent mother paste is identical with embodiment 1.

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Abstract

A mono-component epoxy resin adhesive with high peeling strength is provided, comprising epoxy resin, toughening agent, epoxy diluent, coupling agent and filler, wherein, further comprising prefabricated parent paste of curing agent comprising the following perception according to weight parts: stabilizer 1 part; epoxy resin 30 to 80 parts; and latent curing agent 15 to 40 parts. The advantages are as follows: adding stabilizer to prefabricated parent paste of curing agent, for rapid solidification at low temperature with storage stability. The prepared adhesive can be solidified at 100 deg C. in 15 to 30min, and be stored for 3 month at 25 deg C., with toughness and peeling strength improved greatly adding toughening agent in association. The peeling strength can be 150 to 360N / 25mm while shear strength is 20 to 30MPa.

Description

technical field [0001] The invention relates to a single-component epoxy resin adhesive with high peeling strength and a preparation method thereof. The epoxy resin adhesive has excellent peeling strength and bonding strength. Background technique [0002] Epoxy resin adhesives are widely used in many fields such as adhesives, sealants, paints, etc. Patent No. ZL200410013080.0 discloses a two-component adhesive, component A includes bisphenol A epoxy resin, diluent propylene oxide Base ether, filler nano-silica; B component includes amine curing agent, epoxy resin, accelerator, coupling agent and filler. [0003] Another patent application number 200480029599.6 describes a latent curing agent for epoxy resin, which contains a curing agent and a resin coated with the curing agent. Minute gel, stable storage for 7 days at 40°C. [0004] However, since the two-component epoxy resin adhesive needs to mix the base resin material and the curing agent material in a specified rati...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C09J163/00C08J5/12
Inventor 王卫华戴宏程张德成李斌
Owner SHANGHAI HUITIAN NEW CHEMICAL MATERIALS CO LTD
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