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Chip scale package for a micro component and preparation method

A technology of integrated circuits and sensors, applied in the field of chip-level packaging, to achieve the effect of small overall footprint

Inactive Publication Date: 2011-10-05
EPISTAR CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Although the techniques described in the previous literature remarkably form relatively small packages, these techniques require the use of wire bonds for the electrical connection between the leadframe and the die for the MEMS device

Method used

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  • Chip scale package for a micro component and preparation method
  • Chip scale package for a micro component and preparation method
  • Chip scale package for a micro component and preparation method

Examples

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Embodiment Construction

[0019] figure 2 An example of wafer 14 is illustrated that includes CMOS sensor integrated circuits and MEMS devices, such as accelerometers, gyroscopes, or other inertial sensors. Other types of MEMS devices can also be integrated with the circuit. Such as image 3 As shown, MEMS devices 12 are fabricated on the same wafer 14 as CMOS integrated circuits 10 . In the illustrated example, MEMS device 12 is formed on an inner region 16 of wafer 14 , and bonding pads 18 near the periphery of wafer 14 provide electrical connections to and from wafer 14 . In the illustrated example, wafer 14 is symmetrical in the sense that the MEMS devices are located substantially in the center of the wafer. However, in other implementations, the MEMS device can be off-centered on the wafer. Buried or on-chip interconnects may be used to couple MEMS device 12 to CMOS integrated circuit 10 . Additional details of CMOS integrated circuits are not required for an understanding of the present in...

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PUM

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Abstract

A package includes a sensor die with a micro component, such as a MEMS device, coupled to an integrated circuit which may include, for example., CMOS circuitry, and one or more electrically conductive bond pads near the periphery of the sensor die. A semiconductor cap structure is attached to the sensor die. The front side of the cap structure is attached to the sensor die by a seal ring to hermetically encapsulate an area of the sensor die where the micro component is located. The bond pads on the sensor die are located outside the area encapsulated by the seal ring. Electrical leads, which extend along outer side edges of the semiconductor cap structure from its front side to its back side, are coupled to the micro component via the bond pads.

Description

technical field [0001] The present invention relates to chip scale packaging of microcomponents such as microelectromechanical systems (MEMS) devices. Background technique [0002] Proper packaging of microcomponents is important to ensure the integrity of signals entering and leaving the microcomponent, often determining the overall cost and size of the assembly. [0003] For example, MEMS devices, such as accelerometers and other inertial sensors, have been found in a variety of consumer products including laptops, mobile phones, and handheld computers. In some applications, MEMS devices are fabricated on the same wafer as signal processing circuitry. For example, a BiCMOS circuit fabrication process can be combined with a surface micro-machined MEMS process. Integrating microcomponents with circuits can facilitate signal amplification and signal processing. [0004] The overall process of manufacturing a package enclosing such an integrated MEMS device may include the ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B81C1/00
CPCH01L2224/32245H01L2924/10253H01L2224/73265H01L2224/48247B81C1/0023H01L2924/1461H01L2924/181H01L2224/48095H01L2924/00H01L2924/00012
Inventor 约亨·库曼马蒂亚斯·赫谢尔
Owner EPISTAR CORP